Patents by Inventor Nozomu Matsuzaki
Nozomu Matsuzaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10354735Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: GrantFiled: August 29, 2018Date of Patent: July 16, 2019Assignee: Renesas Electronics CorporationInventors: Toshihiro Tanaka, Yukiko Umemoto, Mitsuru Hiraki, Yutaka Shinagawa, Masamichi Fujito, Kazufumi Suzukawa, Hiroyuki Tanikawa, Takashi Yamaki, Yoshiaki Kamigaki, Shinichi Minami, Kozo Katayama, Nozomu Matsuzaki
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Publication number: 20180374542Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: ApplicationFiled: August 29, 2018Publication date: December 27, 2018Inventors: Toshihiro TANAKA, Yukiko UMEMOTO, Mitsuru HIRAKI, Yutaka SHINAGAWA, Masamichi FUJITO, Kazufumi SUZUKAWA, Hiroyuki TANIKAWA, Takashi YAMAKI, Yoshiaki KAMIGAKI, Shinichi MINAMI, Kozo KATAYAMA, Nozomu MATSUZAKI
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Patent number: 10115469Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: GrantFiled: October 27, 2017Date of Patent: October 30, 2018Assignee: Renesas Electronics CorporationInventors: Toshihiro Tanaka, Yukiko Umemoto, Mitsuru Hiraki, Yutaka Shinagawa, Masamichi Fujito, Kazufumi Suzukawa, Hiroyuki Tanikawa, Takashi Yamaki, Yoshiaki Kamigaki, Shinichi Minami, Kozo Katayama, Nozomu Matsuzaki
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Publication number: 20180047452Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: ApplicationFiled: October 27, 2017Publication date: February 15, 2018Inventors: Toshihiro TANAKA, Yukiko UMEMOTO, Mitsuru HIRAKI, Yutaka SHINAGAWA, Masamichi FUJITO, Kazufumi SUZUKAWA, Hiroyuki TANIKAWA, Takashi YAMAKI, Yoshiaki KAMIGAKI, Shinichi MINAMI, Kozo KATAYAMA, Nozomu MATSUZAKI
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Patent number: 9812211Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: GrantFiled: August 1, 2016Date of Patent: November 7, 2017Assignee: Renesas Electronics CorporationInventors: Toshihiro Tanaka, Yukiko Umemoto, Mitsuru Hiraki, Yutaka Shinagawa, Masamichi Fujito, Kazufumi Suzukawa, Hiroyuki Tanikawa, Takashi Yamaki, Yoshiaki Kamigaki, Shinichi Minami, Kozo Katayama, Nozomu Matsuzaki
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Publication number: 20160336074Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: ApplicationFiled: August 1, 2016Publication date: November 17, 2016Inventors: Toshihiro TANAKA, Yukiko UMEMOTO, Mitsuru HIRAKI, Yutaka SHINAGAWA, Masamichi FUJITO, Kazufumi SUZUKAWA, Hiroyuki TANIKAWA, Takashi YAMAKI, Yoshiaki KAMIGAKI, Shinichi MINAMI, Kozo KATAYAMA, Nozomu MATSUZAKI
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Patent number: 9412750Abstract: A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor substrate via a gate insulator, and a memory gate is formed on the p-type well via a laminated film composed of a silicon oxide film, a silicon nitride film, and a silicon oxide film. The memory gate is adjacent to the selection gate via the laminated film. In the regions on both sides of the selection gate and the memory gate in the p-type well, n-type impurity diffusion layers serving as the source and drain are formed. The region controlled by the selection gate and the region controlled by the memory gate located in the channel region between said impurity diffusion layers have the different charge densities of the impurity from each other.Type: GrantFiled: March 11, 2016Date of Patent: August 9, 2016Assignee: RENESAS ELECTRONICS CORPORATIONInventors: Digh Hisamoto, Shinichiro Kimura, Kan Yasui, Nozomu Matsuzaki
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Patent number: 9412459Abstract: A semiconductor device includes a plurality of nonvolatile memory cells (1). Each of the nonvolatile memory cells comprises a MOS type first transistor section (3) used for information storage, and a MOS type second transistor section (4) which selects the first transistor section. The second transistor section has a bit line electrode (16) connected to a bit line, and a control gate electrode (18) connected to a control gate control line. The first transistor section has a source line electrode (10) connected to a source line, a memory gate electrode (14) connected to a memory gate control line, and a charge storage region (11) disposed directly below the memory gate electrode. A gate withstand voltage of the second transistor section is lower than that of the first transistor section.Type: GrantFiled: March 16, 2014Date of Patent: August 9, 2016Assignee: Renesas Electronics CorporationInventors: Toshihiro Tanaka, Yukiko Umemoto, Mitsuru Hiraki, Yutaka Shinagawa, Masamichi Fujito, Kazufumi Suzukawa, Hiroyuki Tanikawa, Takashi Yamaki, Yoshiaki Kamigaki, Shinichi Minami, Kozo Katayama, Nozomu Matsuzaki
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Publication number: 20160197091Abstract: A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor substrate via a gate insulator, and a memory gate is formed on the p-type well via a laminated film composed of a silicon oxide film, a silicon nitride film, and a silicon oxide film. The memory gate is adjacent to the selection gate via the laminated film. In the regions on both sides of the selection gate and the memory gate in the p-type well, n-type impurity diffusion layers serving as the source and drain are formed. The region controlled by the selection gate and the region controlled by the memory gate located in the channel region between said impurity diffusion layers have the different charge densities of the impurity from each other.Type: ApplicationFiled: March 11, 2016Publication date: July 7, 2016Inventors: Digh HISAMOTO, Shinichiro KIMURA, Kan YASUI, Nozomu MATSUZAKI
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Patent number: 9299715Abstract: A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor substrate via a gate insulator, and a memory gate is formed on the p-type well via a laminated film composed of a silicon oxide film, a silicon nitride film, and a silicon oxide film. The memory gate is adjacent to the selection gate via the laminated film. In the regions on both sides of the selection gate and the memory gate in the p-type well, n-type impurity diffusion layers serving as the source and drain are formed. The region controlled by the selection gate and the region controlled by the memory gate located in the channel region between said impurity diffusion layers have the different charge densities of the impurity from each other.Type: GrantFiled: April 13, 2015Date of Patent: March 29, 2016Assignee: Renesas Electronics CorporationInventors: Digh Hisamoto, Shinichiro Kimura, Kan Yasui, Nozomu Matsuzaki
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Publication number: 20150357248Abstract: The semiconductor integrated circuit device employs on the same silicon substrate a plurality of kinds of MOS transistors with different magnitudes of tunnel current flowing either between the source and gate or between the drain and gate thereof. These MOS transistors include tunnel-current increased MOS transistors at least one of which is for use in constituting a main circuit of the device. The plurality of kinds of MOS transistors also include tunnel-current reduced or depleted MOS transistors at least one of which is for use with a control circuit. This control circuit is inserted between the main circuit and at least one of the two power supply units.Type: ApplicationFiled: August 17, 2015Publication date: December 10, 2015Inventors: Nozomu MATSUZAKI, Hiroyuki MIZUNO, Masashi HORIGUCHI
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Patent number: 9208828Abstract: In a semiconductor device including a memory cell array formed of memory cells using a storage element by a variable resistor and a select transistor, a buffer cell is arranged between a sense amplifier and the memory cell array and between a word driver and the memory cell array. The resistive storage element in the memory cell is connected to a bit-line via a contact formed above the resistive storage element. Meanwhile, in the buffer cell, the contact is not formed above the resistive storage element, and a state of being covered with an insulator is kept upon processing the contact in the memory cell. By such a processing method, exposure and sublimation of a chalcogenide film used in the resistive storage element can be avoided.Type: GrantFiled: May 4, 2014Date of Patent: December 8, 2015Assignee: Renesas Electronics CorporationInventors: Satoru Hanzawa, Fumihiko Nitta, Nozomu Matsuzaki, Toshihiro Tanaka
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Patent number: 9111909Abstract: The semiconductor integrated circuit device employs on the same silicon substrate a plurality of kinds of MOS transistors with different magnitudes of tunnel current flowing either between the source and gate or between the drain and gate thereof. These MOS transistors include tunnel-current increased MOS transistors at least one of which is for use in constituting a main circuit of the device. The plurality of kinds of MOS transistors also include tunnel-current reduced or depleted MOS transistors at least one of which is for use with a control circuit. This control circuit is inserted between the main circuit and at least one of the two power supply units.Type: GrantFiled: February 10, 2014Date of Patent: August 18, 2015Assignee: Tessera Advanced Technologies, Inc.Inventors: Nozomu Matsuzaki, Hiroyuki Mizuno, Masashi Horiguchi
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Publication number: 20150221664Abstract: A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor substrate via a gate insulator, and a memory gate is formed on the p-type well via a laminated film composed of a silicon oxide film, a silicon nitride film, and a silicon oxide film. The memory gate is adjacent to the selection gate via the laminated film. In the regions on both sides of the selection gate and the memory gate in the p-type well, n-type impurity diffusion layers serving as the source and drain are formed. The region controlled by the selection gate and the region controlled by the memory gate located in the channel region between said impurity diffusion layers have the different charge densities of the impurity from each other.Type: ApplicationFiled: April 13, 2015Publication date: August 6, 2015Inventors: Digh HISAMOTO, Shinichiro KIMURA, Kan YASUI, Nozomu MATSUZAKI
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Publication number: 20150214476Abstract: Manufacturing processes for phase change memory have suffered from the problem of chalcogenide material being susceptible to delamination, since this material exhibits low adhesion to high melting point metals and silicon oxide films. Furthermore, chalcogenide material has low thermal stability and hence tends to sublime during the manufacturing process of phase change memory. According to the present invention, conductive or insulative adhesive layers are formed over and under the chalcogenide material layer to enhance its delamination strength. Further, a protective film made up of a nitride film is formed on the sidewalls of the chalcogenide material layer to prevent sublimation of the chalcogenide material layer.Type: ApplicationFiled: April 9, 2015Publication date: July 30, 2015Inventors: Yuichi Matsui, Nozomu Matsuzaki, Norikatsu Takaura, Naoki Yamamoto, Hideyuki Matsuoka, Tomio Iwasaki
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Patent number: 9012968Abstract: A non-volatile semiconductor memory device with good write/erase characteristics is provided. A selection gate is formed on a p-type well of a semiconductor substrate via a gate insulator, and a memory gate is formed on the p-type well via a laminated film composed of a silicon oxide film, a silicon nitride film, and a silicon oxide film. The memory gate is adjacent to the selection gate via the laminated film. In the regions on both sides of the selection gate and the memory gate in the p-type well, n-type impurity diffusion layers serving as the source and drain are formed. The region controlled by the selection gate and the region controlled by the memory gate located in the channel region between said impurity diffusion layers have the different charge densities of the impurity from each other.Type: GrantFiled: April 18, 2013Date of Patent: April 21, 2015Assignee: Renesas Electronics CorporationInventors: Digh Hisamoto, Shinichiro Kimura, Kan Yasui, Nozomu Matsuzaki
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Patent number: 8890107Abstract: Manufacturing processes for phase change memory have suffered from the problem of chalcogenide material being susceptible to delamination, since this material exhibits low adhesion to high melting point metals and silicon oxide films. Furthermore, chalcogenide material has low thermal stability and hence tends to sublime during the manufacturing process of phase change memory. According to the present invention, conductive or insulative adhesive layers are formed over and under the chalcogenide material layer to enhance its delamination strength. Further, a protective film made up of a nitride film is formed on the sidewalls of the chalcogenide material layer to prevent sublimation of the chalcogenide material layer.Type: GrantFiled: November 5, 2009Date of Patent: November 18, 2014Assignee: Renesas Electronics CorporationInventors: Yuichi Matsui, Nozomu Matsuzaki, Norikatsu Takaura, Naoki Yamamoto, Hideyuki Matsuoka, Tomio Iwasaki
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Patent number: 8866120Abstract: Manufacturing processes for phase change memory have suffered from the problem of chalcogenide material being susceptible to delamination, since this material exhibits low adhesion to high melting point metals and silicon oxide films. Furthermore, chalcogenide material has low thermal stability and hence tends to sublime during the manufacturing process of phase change memory. According to the present invention, conductive or insulative adhesive layers are formed over and under the chalcogenide material layer to enhance its delamination strength. Further, a protective film made up of a nitride film is formed on the sidewalls of the chalcogenide material layer to prevent sublimation of the chalcogenide material layer.Type: GrantFiled: December 7, 2011Date of Patent: October 21, 2014Assignee: Renesas Electronics CorporationInventors: Yuichi Matsui, Nozomu Matsuzaki, Norikatsu Takaura, Naoki Yamamoto, Hideyuki Matsuoka, Tomio Iwasaki
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Patent number: 8859344Abstract: Manufacturing processes for phase change memory have suffered from the problem of chalcogenide material being susceptible to delamination, since this material exhibits low adhesion to high melting point metals and silicon oxide films. Furthermore, chalcogenide material has low thermal stability and hence tends to sublime during the manufacturing process of phase change memory. According to the present invention, conductive or insulative adhesive layers are formed over and under the chalcogenide material layer to enhance its delamination strength. Further, a protective film made up of a nitride film is formed on the sidewalls of the chalcogenide material layer to prevent sublimation of the chalcogenide material layer.Type: GrantFiled: December 7, 2011Date of Patent: October 14, 2014Assignee: Renesas Electronics CorporationInventors: Yuichi Matsui, Nozomu Matsuzaki, Norikatsu Takaura, Naoki Yamamoto, Hideyuki Matsuoka, Tomio Iwasaki
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Publication number: 20140252495Abstract: The semiconductor integrated circuit device employs on the same silicon substrate a plurality of kinds of MOS transistors with different magnitudes of tunnel current flowing either between the source and gate or between the drain and gate thereof. These MOS transistors include tunnel-current increased MOS transistors at least one of which is for use in constituting a main circuit of the device. The plurality of kinds of MOS transistors also include tunnel-current reduced or depleted MOS transistors at least one of which is for use with a control circuit. This control circuit is inserted between the main circuit and at least one of the two power supply units.Type: ApplicationFiled: February 10, 2014Publication date: September 11, 2014Applicant: RENESAS ELECTRONICS CORPORATIONInventors: Nozomu MATSUZAKI, Hiroyuki MIZUNO, Masashi HORIGUCHI