Abstract: A blast furnace fault determination apparatus includes a processor configured to: calculate a fault index indicative of a degree of fault in a blast furnace; calculate a ventilation index of the blast furnace; and determine a fault condition in the blast furnace using the fault index and the ventilation index.

Abstract: A component built-in module of the present invention includes: a substrate which includes a top surface and a bottom surface; a plurality of electronic components which are mounted on the top surface of the substrate; a resin which seals the top surface of the substrate; and a reinforcing plate which is bonded to the bottom surface of the substrate. The reinforcing plate and the resin are bonded to each other.

Abstract: A component built-in module of the present invention includes: a flexible substrate that includes a first surface and a second surface on an opposite side of the first surface, the first surface including a concave part recessed in a direction from the first surface toward the second surface; a plurality of electronic components that are mounted on the first surface, mounting heights of the electronic components from the first surface to respective upper surfaces of the electronic components differing from each other; and a resin that seals the first surface. Among the plurality of electronic components, at least an electronic component having a highest mounting height is mounted in the concave part.

Abstract: The present invention pertains to a component-containing module that is: provided with a substrate configured from flat sections and a projecting section, and electronic components mounted on the flat sections and the projecting section; and characterized in that the electronic components mounted on the flat sections are sealed in resin, and the electronic component mounted on the projecting section has an upper part thereof exposed above the resin surface.

Abstract: A component built-in module of the present invention includes: a flexible substrate that includes a first surface and a second surface on an opposite side of the first surface, the first surface including a concave part recessed in a direction from the first surface toward the second surface; a plurality of electronic components that are mounted on the first surface, mounting heights of the electronic components from the first surface to respective upper surfaces of the electronic components differing from each other; and a resin that seals the first surface. Among the plurality of electronic components, at least an electronic component having a highest mounting height is mounted in the concave part.

Abstract: A component built-in module of the present invention includes: a substrate which includes a top surface and a bottom surface; a plurality of electronic components which are mounted on the top surface of the substrate; a resin which seals the top surface of the substrate; and a reinforcing plate which is bonded to the bottom surface of the substrate. The reinforcing plate and the resin are bonded to each other.

Abstract: A circuit board device includes: plurality of wiring boards (101 and 102) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member (103) arranged between wiring boards (101 and 102) for connecting the electrodes of one wiring board to the electrodes of another wiring board, a functional block (104) composed of a metal material and arranged between the wiring boards (101 and 102) to enclose anisotropic conductive member (103), and a pair of holding blocks (105 and 106) composed of a metal material arranged to clamp the plurality of wiring boards (101 and 102), wherein the plurality of wiring boards (101 and 102), while in a state of being clamped between the pair of holding blocks (105 and 106), is connected together by the anisotropic conductive member (103) and the terminals provided on each of the wiring boards (101 and 102), the functional block (104), and the holding blocks (105 and 106) are electrically co

Abstract: A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness.

Abstract: An electronic device comprises an electronic element package and a mounting substrate on which the electronic element package is mounted. The electronic element package has an LGA electrode. The mounting substrate has a through-hole having a conductor which covers an inner wall. The LGA electrode has an area larger than an opening area of the through-hole on a side facing the LGA electrode. The electronic element package is mounted on the mounting substrate so that at least a part of the opening of the through-hole overlaps with the LGA electrode. The LGA electrode and the conductor of the through-hole are electrically connected to a conductive material provided inside the through-hole. In the LGA electrode, at least a part of the region that does not overlap with the opening of the through-hole is joined to the mounting substrate by an adhesive.

Abstract: A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness.

Abstract: A circuit board device includes: plurality of wiring boards (101 and 102) in which terminals are provided on the front and back surfaces and vias are provided for connecting the terminals together, an anisotropic conductive member (103) arranged between wiring boards (101 and 102) for connecting the electrodes of one wiring board to the electrodes of another wiring board, a functional block (104) composed of a metal material and arranged between the wiring boards (101 and 102) to enclose anisotropic conductive member (103), and a pair of holding blocks (105 and 106) composed of a metal material arranged to clamp the plurality of wiring boards (101 and 102), wherein the plurality of wiring boards (101 and 102), while in a state of being clamped between the pair of holding blocks (105 and 106), is connected together by the anisotropic conductive member (103) and the terminals provided on each of the wiring boards (101 and 102), the functional block (104), and the holding blocks (105 and 106) are electrically co