Abstract: A semiconductor laser apparatus includes: a semiconductor laser device that emits laser beam in a first direction; a collimator lens that collimates a component in a second direction perpendicular to the first direction among components of laser beam emitted from the semiconductor laser device; and a lens fixing block having a lens mounting surface perpendicular to a third direction perpendicular to the first and second directions. A first end portion of the collimator lens in the third direction is fixed to the lens mounting surface of the lens fixing block by a fixing resin, and a fillet is formed on each of two crossing surfaces in the first end portion fixed by the fixing resin.

Abstract: The semiconductor laser module (1) includes: a laser mount (31) having thereon a semiconductor laser chip (32); a fiber mount (40) having thereon an optical fiber (2); a submount (20) on which the laser mount (31) and the fiber mount (40) are placed; and a substrate (10) on which the submount 20 is placed, the substrate (10) having protrusions (11a to 11d) on a top surface thereof, the submount 20 being joined to the substrate (10) with a soft solder (61) spread between the submount (20) and the substrate (10).

Abstract: A fiber mount device 2 includes a fiber sub-mount main body 31 that is made of ceramic transmitting a laser beam having a predetermined wavelength, a bonding pad 33 that is provided on the upper surface of the fiber sub-mount main body 31, and a laser absorption layer 32 that is provided on at least a part of the lower surface of the fiber sub-mount main body 31 and absorbs the laser beam having the predetermined wavelength.

Abstract: The semiconductor laser module (1) includes: a laser mount (31) having thereon a semiconductor laser chip (32); a fiber mount (40) having thereon an optical fiber (2); a submount (20) on which the laser mount (31) and the fiber mount (40) are placed; and a substrate (10) on which the submount 20 is placed, the substrate (10) having protrusions (11a to 11d) on a top surface thereof, the submount 20 being joined to the substrate (10) with a soft solder (61) spread between the submount (20) and the substrate (10).

Abstract: A bonding method of the present invention is a method of bonding two members (A and B) to each other with use of an Au—Sn solder. According to the bonding method of the present invention, after the bonding, an Au—Sn solder (S?) has weight percent of Sn which is not less than 38.0 wt % but not more than 82.3 wt %.

Abstract: The laser device includes a semiconductor laser element having an emission surface from which laser light is emitted, an optical fiber having an end part facing the emission surface, and an optical fiber supporting member which (i) supports the optical fiber and (ii) has a bonding pad to which the optical fiber is fixed by solder. The optical fiber supporting member includes a beam part having (i) a first main surface on which the bonding pad is provided and (ii) a second main surface opposite to the first main surface, and a pillar part which is fixed to a base and is joined to the beam part on an end portion of the beam part such that the second main surface and the base face each other while being spatially away from each other.

Abstract: The laser device includes a semiconductor laser element having an emission surface from which laser light is emitted, an optical fiber having an end part facing the emission surface, and an optical fiber supporting member which (i) supports the optical fiber and (ii) has a bonding pad to which the optical fiber is fixed by solder. The optical fiber supporting member includes a beam part having (i) a first main surface on which the bonding pad is provided and (ii) a second main surface opposite to the first main surface, and a pillar part which is fixed to a base and is joined to the beam part on an end portion of the beam part such that the second main surface and the base face each other while being spatially away from each other.

Abstract: A fiber mount device 2 includes a fiber sub-mount main body 31 that is made of ceramic transmitting a laser beam having a predetermined wavelength, a bonding pad 33 that is provided on the upper surface of the fiber sub-mount main body 31, and a laser absorption layer 32 that is provided on at least a part of the lower surface of the fiber sub-mount main body 31 and absorbs the laser beam having the predetermined wavelength.

Abstract: A laser device includes: a semiconductor laser element having an output surface; an optical fiber having a leading end portion facing the output surface of the semiconductor laser element; and an optical fiber supporting member for supporting the optical fiber, the optical fiber supporting member being made from a non heat insulating material and having a bonding pad to which the optical fiber is fixed by use of solder. The optical fiber supporting member includes a contact portion thermally in contact with a base. The bonding pad is (i) spaced apart from the contact portion so as to be located on a side opposite from the contact portion so that a region to which laser light is applied from another laser element when the optical fiber is fixed to the bonding pad is sandwiched between the bonding pad and the base and (ii) separated spatially from the base.