Abstract: There is provided a method of forming a regular array of rows of subpixels on a workpiece. The subpixels have c different colors, where a colors are formed by printing. The subpixel pitch is s.

Abstract: There is provided a process for forming a layer of electroactive material having a substantially flat profile. The process includes the steps of providing a workpiece having at least one active area; depositing a liquid composition including the electroactive material onto the workpiece in the active area, to form a wet layer; treating the wet layer on the workpiece at a controlled temperature in the range of ?25 to 80° C. and under a vacuum in the range of 10?6 to 1,000 Torr, for a first period of 1-100 minutes, to form a partially dried layer; and heating the partially dried layer to a temperature above 100° C. for a second period of 1-50 minutes to form a dried layer.

Abstract: An electronic device can include an organic device layer having a first and a second portion. In one embodiment, the first portion can have a higher resistivity than the second portion and lie between a first and a second electrode and include not more than 15 mole percent basic material. In a particular embodiment, the first and the second electrode can be an anode and cathode of a pixel. In another particular embodiment, the first and the second electrode can be either both anodes or both cathodes of different pixels. In another embodiment, the organic device layer can include a large molecule material. In still another embodiment, a process of forming the electronic device can include selectively modifying the first portion of the organic device layer.

Abstract: There is provided a method of printing a regular array of rows of subpixels on a workpiece. The subpixels have c different colors and have a subpixel pitch s. A printing head has z nozzles arranged in a row with a spacing p, where z=n1(c) and p=n2(s), the printhead being at a first position relative to the workpiece. There are c different printing inks, one for each of the c colors, and each of the printing inks is supplied to the nozzles in a regular alternating pattern. The method includes steps of printing a first set of z rows of subpixels with the printing head; moving the workpiece laterally relative to the printing head by a distance d1, where d1=n3(s); printing a second set of z rows of subpixels with the printing head; repeating the printing steps for a total of n2 sets of z rows of subpixels. Variables include: c, an integer greater than 1; n1, n2, and n3 which are the same or different and are independently selected from integers greater than 0, with the proviso that n2 is not a multiple of c.

Abstract: Described are encapsulation assemblies useful for electronic devices having a substrate and an active area, the encapsulation assembly comprising a barrier sheet and a barrier structure that contains an adhesive and a discreet material, wherein the barrier structure is configured so as to substantially hermetically seal an electronic device when in use thereon. The barrier structure bonds the encapsulation assembly to the electronic device and contains a getter material to protect against environmental degradation.

Abstract: An electronic device having a substrate structure having an undercut region is provided and further included is a method for forming an undercut region of a substrate structure. The method includes forming a patterned protective layer over a first electrode. The method also includes forming the substrate structure over the patterned protective layer. An opening within the substrate structure overlies an exposed portion of the substrate structure. The method further includes removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming an undercut region of the substrate structure. The method still further includes depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer, and solidifying the liquid to form a solid layer.

Abstract: An organic electronic device includes a first electrode layer, an organic resistive layer coupled to the first electrode layer wherein the organic resistive layer defines at least three regions, an organic active layer coupled to the organic resistive layer, and a second electrode layer coupled to the organic active layer. Each of the at least three regions is characterized by one of the plurality of resistances and the plurality of resistances includes at least three discrete resistances that are different from one another. The regions can be fabricated by selectively exposing portions of the organic resistive layer to a chemical, selectively removing portions of the organic resistive layer, or depositing a plurality of blends.

Abstract: An organic electronic device includes a first electrode layer, an organic resistive layer coupled to the first electrode layer wherein the organic resistive layer defines at least three regions, an organic active layer coupled to the organic resistive layer, and a second electrode layer coupled to the organic active layer. Each of the at least three regions is characterized by one of the plurality of resistances and the plurality of resistances includes at least three discrete resistances that are different from one another. The regions can be fabricated by selectively exposing portions of the organic resistive layer to a chemical, selectively removing portions of the organic resistive layer, or depositing a plurality of blends.

Abstract: An electronic device having a substrate structure having an undercut region is provided and further included is a method for forming an undercut region of a substrate structure. The method includes forming a patterned protective layer over a first electrode. The method also includes forming the substrate structure over the patterned protective layer. An opening within the substrate structure overlies an exposed portion of the substrate structure. The method further includes removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming an undercut region of the substrate structure. The method still further includes depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer, and solidifying the liquid to form a solid layer.

Abstract: An electronic device can include an organic device layer having a first and a second portion. In one embodiment, the first portion can have a higher resistivity than the second portion and lie between a first and a second electrode and include not more than 15 mole percent basic material. In a particular embodiment, the first and the second electrode can be an anode and cathode of a pixel. In another particular embodiment, the first and the second electrode can be either both anodes or both cathodes of different pixels. In another embodiment, the organic device layer can include a large molecule material. In still another embodiment, a process of forming the electronic device can include selectively modifying the first portion of the organic device layer.

Abstract: An electronic device having a substrate structure having an undercut region is provided and further included is a method for forming an undercut region of a substrate structure. The method includes forming a patterned protective layer over a first electrode. The method also includes forming the substrate structure over the patterned protective layer. An opening within the substrate structure overlies an exposed portion of the substrate structure. The method further includes removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming an undercut region of the substrate structure. The method still further includes depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer, and solidifying the liquid to form a solid layer.

Abstract: A method of fabricating an organic electronic device includes forming a first electrode layer, forming an organic resistive layer on the first electrode, selectively exposing the organic resistive layer to an ultraviolet light, forming an organic active layer on the selectively exposed organic resistive layer, and forming a second electrode on the organic active layer. An organic electronic device includes a first electrode layer, an organic resistive layer, an organic active layer and a second electrode layer. The organic resistive layer defines at least three regions. Each of the three regions is characterized by one of a plurality of resistances that are different from one another. Within each of the three regions, the resistance of the organic resistive layer at a first surface is different than the resistance of the organic resistive layer at a second surface.

Abstract: A process for protecting first electrodes, conductive leads and the underlying substrate from the process of removing organic layers during the fabrication of an organic electronic device. After first electrodes and conductive leads are formed over a substrate, a protective layer is selectively formed over the structure, with the protective layer not being disposed over selected portions of the first electrodes, the conductive leads and the substrate. Organic layers are then formed over the structure, and second electrodes are formed over the organic layers. Those portions of the organic layers disposed over the selected portions of the first electrodes, conductive leads and substrate are removed, and the protective layer protects adjacent portions of the first electrodes, conductive leads and substrate from the process of removing the portions of the organic layers.

Abstract: An electronic device can include a substrate, a lid, a getter material adhered to at least a portion of at least one surface of the electronic device, wherein the portion of the surface will be an interior surface of the electronic device, and a sealing material adhered to at least a portion of the substrate and a portion of the lid. The sealing material includes a spacer material. A method for sealing the electronic device includes includes attaching the substrate and the lid in an inert atmosphere under an absolute pressure of less than 760 torr wherein the sealing material contacts both the substrate and the lid, and raising the pressure on the exterior of the device to ambient pressure.

Abstract: A process for protecting first electrodes, conductive leads and the underlying substrate from the process of removing organic layers during the fabrication of an organic electronic device. After first electrodes and conductive leads are formed over a substrate, a protective layer is selectively formed over the structure, with the protective layer not being disposed over selected portions of the first electrodes, the conductive leads and the substrate. Organic layers are then formed over the structure, and second electrodes are formed over the organic layers. Those portions of the organic layers disposed over the selected portions of the first electrodes, conductive leads and substrate are removed, and the protective layer protects adjacent portions of the first electrodes, conductive leads and substrate from the process of removing the portions of the organic layers.

Abstract: An electronic device having a substrate structure having an undercut region is provided and further included is a method for forming an undercut region of a substrate structure. The method includes forming a patterned protective layer over a first electrode. The method also includes forming the substrate structure over the patterned protective layer. An opening within the substrate structure overlies an exposed portion of the substrate structure. The method further includes removing the exposed portion of the patterned protective layer, thereby exposing a portion of the first electrode and forming an undercut region of the substrate structure. The method still further includes depositing a liquid over the first electrode after removing the exposed portion of the patterned protective layer, and solidifying the liquid to form a solid layer.

Abstract: An organic electronic device includes a first electrode layer, an organic resistive layer coupled to the first electrode layer wherein the organic resistive layer defines at least three regions, an organic active layer coupled to the organic resistive layer, and a second electrode layer coupled to the organic active layer. Each of the at least three regions is characterized by one of the plurality of resistances and the plurality of resistances includes at least three discrete resistances that are different from one another. The regions can be fabricated by selectively exposing portions of the organic resistive layer to a chemical, selectively removing portions of the organic resistive layer, or depositing a plurality of blends.

Abstract: A process for protecting first electrodes, conductive leads and the underlying substrate from the process of removing organic layers during the fabrication of an organic electronic device. After first electrodes and conductive leads are formed over a substrate, a protective layer is selectively formed over the structure, with the protective layer not being disposed over selected portions of the first electrodes, the conductive leads and the substrate. Organic layers are then formed over the structure, and second electrodes are formed over the organic layers. Those portions of the organic layers disposed over the selected portions of the first electrodes, conductive leads and substrate are removed, and the protective layer protects adjacent portions of the first electrodes, conductive leads and substrate from the process of removing the portions of the organic layers.