Patents by Inventor Nuno Chen

Nuno Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTERCONNECTING PROCESS AND METHOD FOR FABRICATING COMPLEX DIELECTRIC BARRIER ALYER
    Publication number: 20070166998
    Abstract: An interconnecting process is described. First, a dielectric layer with a plurality of openings is provided. Then, a metallic layer is formed to fill up the openings. A first dielectric barrier layer is formed to cover the dielectric layer and the metallic layer. Thereafter, a second dielectric barrier layer is formed over the first dielectric barrier layer. The second dielectric barrier layer is used to repair the first dielectric barrier layer and improve the reliability and yield of the process.
    Type: Application
    Filed: April 2, 2007
    Publication date: July 19, 2007
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: YI-CHING WU, CHRIS CHEN, CHIH-HSIANG SHIAU, NUNO CHEN, LEONARD CHEN
  • Interconnecting process and method for fabricating complex dielectric barrier layer
    Publication number: 20060194427
    Abstract: An interconnecting process is described. First, a dielectric layer with a plurality of openings is provided. Then, a metallic layer is formed to fill up the openings. A first dielectric barrier layer is formed to cover the dielectric layer and the metallic layer. Thereafter, a second dielectric barrier layer is formed over the first dielectric barrier layer. The second dielectric barrier layer is used to repair the first dielectric barrier layer and improve the reliability and yield of the process.
    Type: Application
    Filed: February 25, 2005
    Publication date: August 31, 2006
    Inventors: Yi-Ching Wu, Chris Chen, Chih-Hsiang Shiau, Nuno Chen, Leonard Chen