Patents by Inventor Nur Syazwani Binti Mohd Najman

Nur Syazwani Binti Mohd Najman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device including semiconductor dies of differing sizes and capacities
    Patent number: 11552050
    Abstract: A semiconductor device includes a stack of semiconductor dies, stacked in a stepped offset configuration, where the dies have different storage capacities and different sizes. Using dies of different sizes allows dies to be added to the stack without adding to the footprint of the semiconductor device. Using dies of different storage capacity also allows semiconductor devices to be tailored to specific storage capacity needs.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: January 10, 2023
    Assignee: Western Digital Technologies, Inc.
    Inventors: Ahmad Zarif Bin Azahar, Nur Syazwani Binti Mohd Najman, Muhammad Syafiq Bin Mazlan, Rolando Reyes, Jr., Hooi Bin Lim
  • SEMICONDUCTOR DEVICE INCLUDING SEMICONDUCTOR DIES OF DIFFERING SIZES AND CAPACITIES
    Publication number: 20220230992
    Abstract: A semiconductor device includes a stack of semiconductor dies, stacked in a stepped offset configuration, where the dies have different storage capacities and different sizes. Using dies of different sizes allows dies to be added to the stack without adding to the footprint of the semiconductor device. Using dies of different storage capacity also allows semiconductor devices to be tailored to specific storage capacity needs.
    Type: Application
    Filed: February 12, 2021
    Publication date: July 21, 2022
    Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Ahmad Zarif Bin Azahar, Nur Syazwani Binti Mohd Najman, Muhammad Syafiq Bin Mazlan, Rolando Reyes, JR., Hooi Bin Lim