Patents by Inventor Nurtjahya Sambawa

Nurtjahya Sambawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power/ground metallization routing in a semiconductor device
    Patent number: 6570195
    Abstract: A semiconductor device and a method of laying out the same includes routing primary power and ground distributions in the second metallization layer, rather than the first metallization as is conventionally done. This improves routability in the first metallization layer while providing sufficient current handling ability in the power and ground distributions.
    Type: Grant
    Filed: August 13, 2001
    Date of Patent: May 27, 2003
    Assignee: NurLogic Design, Inc.
    Inventors: Michael J. Brunolli, Behnan Malek-Khosravi, Nurtjahya Sambawa
  • Power/ground metallization routing in a semiconductor device
    Publication number: 20010054720
    Abstract: A semiconductor device and a method of laying out the same includes routing primary power and ground distributions in the second metallization layer, rather than the first metallization as is conventionally done. This improves routability in the first metallization layer while providing sufficient current handling ability in the power and ground distributions.
    Type: Application
    Filed: August 13, 2001
    Publication date: December 27, 2001
    Applicant: Nurlogic Design, Inc.
    Inventors: Michael J. Brunolli, Behnan Malek-Khosravi, Nurtjahya Sambawa
  • Power/ground metallization routing in a semiconductor device
    Patent number: 6307222
    Abstract: A semiconductor device and a method of laying out the same includes routing primary power and ground distributions in the second metallization layer, rather than the first metallization as is conventionally done. This improves routability in the first metallization layer while providing sufficient current handling ability in the power and ground distributions.
    Type: Grant
    Filed: August 3, 1999
    Date of Patent: October 23, 2001
    Assignee: Nurlogic Design, Inc.
    Inventors: Michael J. Brunolli, Behnan Malek-Khosravi, Nurtjahya Sambawa
  • Power ground metallization routing in a semiconductor device
    Patent number: 5981987
    Abstract: A semiconductor device and a method of laying out the same includes routing primary power and ground distributions in the second metallization layer, rather than the first metallization as is conventionally done. This improves routability in the first metallization layer while providing sufficient current handling ability in the power and ground distributions.
    Type: Grant
    Filed: December 2, 1997
    Date of Patent: November 9, 1999
    Assignee: Nurlogic Design, Inc.
    Inventors: Michael J. Brunolli, Behnan Malek-Khosravi, Nurtjahya Sambawa