Abstract: A method includes attaching semiconductor die to a carrier between copper pillars, covering with molding, backside grinding to expose first ends of the pillars and backside drain contacts of the die, and applying a layer of conductive material to electrically connect the first ends of the pillars and the backside drain contacts. The method further includes cutting grooves in the conductive material to isolate adjacent die, removing the carrier to expose second ends of the copper pillars in place in the molding, applying another layer of conductive material to electrically connect the second ends of the copper pillars and source contacts of adjacent die, singulating individual MCM packages each including a first die and a second die with a source of the first die connected to a drain of the second die via one of the copper pillars left in place in the molding.

Abstract: A method includes attaching semiconductor die to a carrier between copper pillars, covering with molding, backside grinding to expose first ends of the pillars and backside drain contacts of the die, and applying a layer of conductive material to electrically connect the first ends of the pillars and the backside drain contacts. The method further includes cutting grooves in the conductive material to isolate adjacent die, removing the carrier to expose second ends of the copper pillars in place in the molding, applying another layer of conductive material to electrically connect the second ends of the copper pillars and source contacts of adjacent die, singulating individual MCM packages each including a first die and a second die with a source of the first die connected to a drain of the second die via one of the copper pillars left in place in the molding.

Abstract: A multi-chip module (MCM) includes a molded body portion having a first outer surface and a second outer surface. A conductive layer defines at least a portion of the first outer surface A conductive connection layer portion is disposed outside of the second outer surface of the molded body portion. A first semiconductor die and a second semiconductor die are disposed between the conductive layer and the conductive connection layer, and first molding portion is disposed between the first semiconductor die and the second semiconductor die. The first molding portion extends between the first outer surface and the second outer surface of the molded body portion. A conductive pillar is electrically coupled to the conductive layer defining at least a portion of the first outer surface and the conductive connection layer portion disposed outside of the second outer surface.

Abstract: A multi-chip module (MCM) includes a molded body portion having a first outer surface and a second outer surface. A conductive layer defines at least a portion of the first outer surface A conductive connection layer portion is disposed outside of the second outer surface of the molded body portion. A first semiconductor die and a second semiconductor die are disposed between the conductive layer and the conductive connection layer, and first molding portion is disposed between the first semiconductor die and the second semiconductor die. The first molding portion extends between the first outer surface and the second outer surface of the molded body portion. A conductive pillar is electrically coupled to the conductive layer defining at least a portion of the first outer surface and the conductive connection layer portion disposed outside of the second outer surface.