Abstract: The described embodiments include a computing device that comprises at least one memory die having memory circuits and memory die processing circuits, and a logic die coupled to the at least one memory die, the logic die having logic die processing circuits. In the described embodiments, the memory die processing circuits are configured to perform memory die processing operations on data retrieved from or destined for the memory circuits and the logic die processing circuits are configured to perform logic die processing operations on data retrieved from or destined for the memory circuits.

Abstract: The present application describes embodiments of methods for tournament prediction of power gating in processing devices. Some embodiments of the method include selecting one of a plurality of predictions of a duration of a time to a power state transition of a component in a processing device. The plurality of predictions are generated using a corresponding plurality of prediction algorithms. Some embodiments of the method also include deciding whether to transition the component from a first power state to a second power state based on the selected prediction.

Abstract: The desire to use an Accelerated Processing Device (APD) for general computation has increased due to the APD's exemplary performance characteristics. However, current systems incur high overhead when dispatching work to the APD because a process cannot be efficiently identified or preempted. The occupying of the APD by a rogue process for arbitrary amounts of time can prevent the effective utilization of the available system capacity and can reduce the processing progress of the system. Embodiments described herein can overcome this deficiency by enabling the system software to pre-empt a process executing on the APD for any reason. The APD provides an interface for initiating such a pre-emption. This interface exposes an urgency of the request which determines whether the process being preempted is allowed a grace period to complete its issued work before being forced off the hardware.

Abstract: An integrated circuit (IC) package includes a stacked-die memory device. The stacked-die memory device includes a set of one or more stacked memory dies implementing memory cell circuitry. The stacked-die memory device further includes a set of one or more logic dies electrically coupled to the memory cell circuitry. The set of one or more logic dies includes a query controller and a memory controller. The memory controller is coupleable to at least one device external to the stacked-die memory device. The query controller is to perform a query operation on data stored in the memory cell circuitry responsive to a query command received from the external device.

Abstract: A die-stacked memory device incorporates a reconfigurable logic device to provide implementation flexibility in performing various data manipulation operations and other memory operations that use data stored in the die-stacked memory device or that result in data that is to be stored in the die-stacked memory device. One or more configuration files representing corresponding logic configurations for the reconfigurable logic device can be stored in a configuration store at the die-stacked memory device, and a configuration controller can program a reconfigurable logic fabric of the reconfigurable logic device using a selected one of the configuration files. Due to the integration of the logic dies and the memory dies, the reconfigurable logic device can perform various data manipulation operations with higher bandwidth and lower latency and power consumption compared to devices external to the die-stacked memory device.

Abstract: Methods, systems and computer readable storage mediums for more efficient and flexible scheduling of tasks on an asymmetric processing system having at least one host processor and one or more slave processors, are disclosed. An example embodiment includes, determining a data access requirement of a task, comparing the data access requirement to respective local memories of the one or more slave processors selecting a slave processor from the one or more slave processors based upon the comparing, and running the task on the selected slave processor.

Abstract: A memory accessing agent includes a memory access generating circuit and a memory controller. The memory access generating circuit is adapted to generate multiple memory accesses in a first ordered arrangement. The memory controller is coupled to the memory access generating circuit and has an output port, for providing the multiple memory accesses to the output port in a second ordered arrangement based on the memory accesses and characteristics of an external memory. The memory controller determines the second ordered arrangement by calculating an efficient row burst value and interrupting multiple row-hit requests to schedule a row-miss request based on the efficient row burst value.

Abstract: A die-stacked memory device incorporates a reconfigurable logic device to provide implementation flexibility in performing various data manipulation operations and other memory operations that use data stored in the die-stacked memory device or that result in data that is to be stored in the die-stacked memory device. One or more configuration files representing corresponding logic configurations for the reconfigurable logic device can be stored in a configuration store at the die-stacked memory device, and a configuration controller can program a reconfigurable logic fabric of the reconfigurable logic device using a selected one of the configuration files. Due to the integration of the logic dies and the memory dies, the reconfigurable logic device can perform various data manipulation operations with higher bandwidth and lower latency and power consumption compared to devices external to the die-stacked memory device.

Abstract: A system, method, and computer program product are provided for a memory device system. One or more memory dies and at least one logic die are disposed in a package and communicatively coupled. The logic die comprises a processing device configurable to manage virtual memory and operate in an operating mode. The operating mode is selected from a set of operating modes comprising a slave operating mode and a host operating mode.

Abstract: A system includes an atomic processing engine (APE) coupled to an interconnect. The interconnect is to couple to one or more processor cores. The APE receives a plurality of commands from the one or more processor cores through the interconnect. In response to a first command, the APE performs a first plurality of operations associated with the first command. The first plurality of operations references multiple memory locations, at least one of which is shared between two or more threads executed by the one or more processor cores.

Abstract: Some die-stacked memories will contain a logic layer in addition to one or more layers of DRAM (or other memory technology). This logic layer may be a discrete logic die or logic on a silicon interposer associated with a stack of memory dies. Additional circuitry/functionality is placed on the logic layer to implement functionality to perform various computation operations. This functionality would be desired where performing the operations locally near the memory devices would allow increased performance and/or power efficiency by avoiding transmission of data across the interface to the host processor.

Abstract: A system and method for efficiently limiting storage space for data with particular properties in a cache memory. A computing system includes a cache array and a corresponding cache controller. The cache array includes multiple banks, wherein a first bank is powered down. In response a write request to a second bank for data indicated to be stored in the powered down first bank, the cache controller determines a respective bypass condition for the data. If the bypass condition exceeds a threshold, then the cache controller invalidates any copy of the data stored in the second bank. If the bypass condition does not exceed the threshold, then the cache controller stores the data with a clean state in the second bank. The cache controller writes the data in a lower-level memory for both cases.

Abstract: Some die-stacked memories will contain a logic layer in addition to one or more layers of DRAM (or other memory technology). This logic layer may be a discrete logic die or logic on a silicon interposer associated with a stack of memory dies. Additional circuitry/functionality is placed on the logic layer to implement functionality to perform various data movement and address calculation operations. This functionality would allow compound memory operations—a single request communicated to the memory that characterizes the accesses and movement of many data items. This eliminates the performance and power overheads associated with communicating address and control information on a fine-grain, per-data-item basis from a host processor (or other device) to the memory. This approach also provides better visibility of macro-level memory access patterns to the memory system and may enable additional optimizations in scheduling memory accesses.

Abstract: A system, method, and memory device embodying some aspects of the present invention for remapping external memory addresses and internal memory locations in stacked memory are provided. The stacked memory includes one or more memory layers configured to store data. The stacked memory also includes a logic layer connected to the memory layer. The logic layer has an Input/Output (I/O) port configured to receive read and write commands from external devices, a memory map configured to maintain an association between external memory addresses and internal memory locations, and a controller coupled to the I/O port, memory map, and memory layers, configured to store data received from external devices to internal memory locations.

Abstract: A die-stacked memory device incorporates a data translation controller at one or more logic dies of the device to provide data translation services for data to be stored at, or retrieved from, the die-stacked memory device. The data translation operations implemented by the data translation controller can include compression/decompression operations, encryption/decryption operations, format translations, wear-leveling translations, data ordering operations, and the like. Due to the tight integration of the logic dies and the memory dies, the data translation controller can perform data translation operations with higher bandwidth and lower latency and power consumption compared to operations performed by devices external to the die-stacked memory device.

Abstract: Embodiments include methods, systems, and articles of manufacture directed to identifying transient data upon storing the transient data in a cache memory, and invalidating the identified transient data in the cache memory.

Abstract: In some embodiments, a method for improving reliability in a processor is provided. The method can include replicating input data for first and second lanes of a processor, the first and second lanes being located in a same cluster of the processor and the first and second lanes each generating a respective value associated with an instruction to be executed in the respective lane, and responsive to a determination that the generated values do not match, providing an indication that the generated values do not match.

Abstract: The described embodiments include a computing device with one or more entities (processor cores, processors, etc.). In some embodiments, during operation, a thermal power management unit in the computing device uses a linear prediction to compute a predicted duration of a next idle period for an entity based on the duration of one or more previous idle periods for the entity. Based on the predicted duration of the next idle period, the thermal power management unit configures the entity to operate in a corresponding idle state.

Abstract: Embodiments include methods, systems and computer readable media configured to execute a first kernel (e.g. compute or graphics kernel) with reduced intermediate state storage resource requirements. These include executing a first and second (e.g. prefetch) kernel on a data-parallel processor, such that the second kernel begins executing before the first kernel. The second kernel performs memory operations that are based upon at least a subset of memory operations in the first kernel.

Abstract: A system and method embodiments for optimally allocating compute kernels to different types of processors, such as CPUs and GPUs, in a heterogeneous computer system are disclosed. These include comparing a kernel profile of a compute kernel to respective processor profiles of a plurality of processors in a heterogeneous computer system, selecting at least one processor from the plurality of processors based upon the comparing, and scheduling the compute kernel for execution in the selected at least one processor.