Abstract: A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.

Abstract: An object forming apparatus and a controlling method thereof are provided. The object forming apparatus includes an injector configured to inject an object forming material based on object data, a base part in which an object is formed through stacking of the injected object forming material, a sensor configured to detect a height of the object stacked on the base part, and a controller configured to control the injector based on a signal output from the sensor.

Abstract: An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.

Abstract: A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.

Abstract: An electromagnetic interference (EMI) shielding structure and a method for manufacturing are provided. The EMI shielding structure includes a printed circuit board (PCB) on which a plurality of elements are mounted, an insulation molding member configured to cover the plurality of elements, a conductive shielding dam formed along a side surface of the insulation molding member, and a conductive shielding member formed on a top surface of the insulation molding member.

Abstract: An object forming apparatus and a controlling method thereof are provided. The object forming apparatus includes an injector configured to inject an object forming material based on object data, a base part in which an object is formed through stacking of the injected object forming material, a sensor configured to detect a height of the object stacked on the base part, and a controller configured to control the injector based on a signal output from the sensor.

Abstract: A circuit element package, a manufacturing method thereof, and a manufacturing apparatus thereof are provided. The circuit element package includes a circuit element disposed on a printed circuit board, an insulating layer covering the circuit element, a first shielding layer covering a side surface of the insulating layer, and a second shielding layer covering an upper surface of the insulating layer and electrically connected to the first shielding layer.

Abstract: A multi-color ink for 3D printing, a 3D printer, and a method of controlling the 3D printer are provided. The multi-color ink for 3D printing including a first ink composition that includes a photocurable material, a photoinitiator configured to cure the photocurable material, a first colorant, and an anti-intercolor bleed agent configured to prevent intercolor bleeding occurring when the plurality of ink compositions come into contact with each other, and a second ink composition that includes a photocurable material, a photoinitiator configured to cure the photocurable material, and a second colorant having an acid moiety involved in a reaction with the anti-intercolor bleed agent to cause aggregation. The multi-color ink for 3D printing may enable a clear image by inhibiting intercolor bleeding that occurs when ink compositions with different colors are printed to be adjacent to each other before curing during 3D printing.

Abstract: A semiconductor package includes a semiconductor chip mounted on a substrate, an insulating layer covering at least a portion of the semiconductor chip and including a thixotropic material or a hot melt material, and a shielding layer covering at least a portion of the semiconductor chip and the insulating layer. A method of manufacturing the semiconductor package includes forming an insulating layer and a shielding layer having a high aspect ratio by using a three-dimensional printer.

Abstract: A three dimensional (3D) printer sprays and solidifies liquid ink to build a 3D object prevents implementation of unintended color due to a mix of different color ink, and increases 3D printing speed by enhancing the process of spraying and solidifying the ink. The control method of the 3D printer for building a 3D object by laminating a plurality of layers includes forming first areas not adjacent to each other in one of the plurality of layers and solidifying the first areas; and forming second areas adjacent to the solidified first areas and solidifying the second areas.

Abstract: A multi-color ink for 3D printing, a 3D printer, and a method of controlling the 3D printer are provided. The multi-color ink for 3D printing including a first ink composition that includes a photocurable material, a photoinitiator configured to cure the photocurable material, a first colorant, and an anti-intercolor bleed agent configured to prevent intercolor bleeding occurring when the plurality of ink compositions come into contact with each other, and a second ink composition that includes a photocurable material, a photoinitiator configured to cure the photocurable material, and a second colorant having an acid moiety involved in a reaction with the anti-intercolor bleed agent to cause aggregation. The multi-color ink for 3D printing may enable a clear image by inhibiting intercolor bleeding that occurs when ink compositions with different colors are printed to be adjacent to each other before curing during 3D printing.

Abstract: A surface heating type heating unit for a fixing device, and a fixing device and an image forming apparatus including the same. The surface heating type heating unit includes a planar heating element on an outer circumferential surface of a supporter having cylindrical shape, a power feeding terminal at each end of the supporter, and a connector disposed between the planar heating element and the power feeding terminal. The connector is formed on a first region on the power feeding terminal, and includes an adhesive material for adhering the planar heating element and the power feeding terminal, and a conductive material formed on a second region of the power feeding terminal excluding the first region.

Abstract: A surface heating type heating unit for a fixing device, and a fixing device and an image forming apparatus including the same. The surface heating type heating unit includes a planar heating element on an outer circumferential surface of a supporter having cylindrical shape, a power feeding terminal at each end of the supporter, and a connector disposed between the planar heating element and the power feeding terminal. The connector is formed on a first region on the power feeding terminal, and includes an adhesive material for adhering the planar heating element and the power feeding terminal, and a conductive material formed on a second region of the power feeding terminal excluding the first region.

Abstract: A method and apparatus of dot counting. The apparatus includes a nozzle portion having a length corresponding to a width of a printing medium, a dot counting unit to group head nozzles by position and to count a discharged dot count per line for each group, a control unit to determine whether the group has been used to print using the discharged dot count per line, a counter to count a number of times that the group is used to print based on the determination result, and a memory to store a sum of the counted numbers of times, in which the control unit controls the counter to count the number of times that the group is used to print with respect to each line of image data when the image data is created by a head chip, and a sum of the counted number of times is stored in the memory.

Abstract: A method and apparatus of dot counting. The apparatus includes a nozzle portion having a length corresponding to a width of a printing medium, a dot counting unit to group head nozzles by position and to count a discharged dot count per line for each group, a control unit to determine whether the group has been used to print using the discharged dot count per line, a counter to count a number of times that the group is used to print based on the determination result, and a memory to store a sum of the counted numbers of times, in which the control unit controls the counter to count the number of times that the group is used to print with respect to each line of image data when the image data is created by a head chip, and a sum of the counted number of times is stored in the memory.

Abstract: A method of detecting a missing nozzle and an ink jet print head using the same, that can detect a missing nozzle immediately with a simple process when the missing nozzle is generated. The method of detecting a missing nozzle used in an ink jet print head provided with plural chambers in which an ink is filled, plural heaters corresponding to the chambers, and plural nozzles corresponding to the heaters, can include detecting a temperature of each of the nozzles, and when the detected temperature deviates from a predetermined temperature range, determining that the nozzle is a missing nozzle.

Abstract: An ink-jet print head and a method of manufacturing the same capable of minimizing exfoliation or breakage of a protective layer. The ink-jet print head includes a heater layer which is provided on a substrate, a wire layer which is provided on the heater layer and is formed to expose a predetermined region of the heater layer, a protective layer which covers predetermined regions of the wire layer and the heater layer, and an over coat layer which covers evenly uneven portions on the protective layer.

Abstract: An inkjet printhead and a method of manufacturing the same are provided. The inkjet printhead includes a substrate; a plurality of heaters formed on an upper portion of the substrate for heating ink for generating bubbles; a plurality of metal-oxide semiconductor (MOS) field effect transistors (FETs) formed on the substrate for addressing the heaters and applying electric current to the heaters; first, second, and third interconnecting layers that are sequentially formed on the MOS FETs and electrically connected to each other for applying signals to the MOS FETs; a chamber layer for defining an ink chamber, which is filled with ink for ejection, on an upper portion of the heaters; and a nozzle layer having a nozzle, through which the ink is ejected, on an upper portion of the chamber layer.

Abstract: An ink-jet print head and a method of making the same comprising the steps of sequentially laminating a heating layer and an electric conductive layer on a substrate, patterning the electric conductive layer to expose a predetermined area of the top surface of the heating layer, forming a protective layer on the top surfaces of the electric conductive layer and exposed heating layer, and laminating an ink chamber barrier and a nozzle plate on the top surface of the protective layer, thereby forming an ink chamber. The protective layer is provided by forming a cavitation layer by alternately laminating at least two types of thin film layers of different materials over the exposed heating layer and the electric conductive layer to resist fractures and oxidization resulting from use.

Abstract: An inkjet printhead and a method of manufacturing the same are provided. The inkjet printhead includes a substrate; a plurality of heaters formed on an upper portion of the substrate for heating ink for generating bubbles; a plurality of metal-oxide semiconductor (MOS) field effect transistors (FETs) formed on the substrate for addressing the heaters and applying electric current to the heaters; first, second, and third interconnecting layers that are sequentially formed on the MOS FETs and electrically connected to each other for applying signals to the MOS FETs; a chamber layer for defining an ink chamber, which is filled with ink for ejection, on an upper portion of the heaters; and a nozzle layer having a nozzle, through which the ink is ejected, on an upper portion of the chamber layer.