Patents by Inventor O-Seob Jeun

O-Seob Jeun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same
    Patent number: 7501700
    Abstract: A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first surface of the first portion and an insulator having an electrically insulating property and thermal conductivity. The insulator has a first surface adjacent to a second surface of the first portion, and a second surface opposite to the first surface of the insulator and exposed to the outside. The semiconductor power module further includes a sealer having an electrically insulating property that covers the power circuit.
    Type: Grant
    Filed: January 6, 2006
    Date of Patent: March 10, 2009
    Assignee: Fairchild Korea Semiconductor Ltd.
    Inventors: Gi-Young Jeun, O-Seob Jeun, Eun-Ho Lee, Seung-Won Lim
  • Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same
    Patent number: 7449774
    Abstract: A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first surface of the first portion and an insulator having an electrically insulating property and thermal conductivity. The insulator is adjacent to a second surface of the first portion of the lead frame. The semiconductor power module further includes a sealer having an electrically insulating property that covers the power circuit and the control circuit.
    Type: Grant
    Filed: September 29, 2000
    Date of Patent: November 11, 2008
    Assignee: Fairchild Korea Semiconductor Ltd.
    Inventors: Gi-Young Jeun, O-Seob Jeun, Eun-Ho Lee, Seung-Won Lim
  • Semiconductor power module having an electrically insulating heat sink and method of manufacturing the same
    Publication number: 20060113562
    Abstract: A semiconductor power module includes a lead frame having a first portion at a first level, a second portion surrounding the first portion at a second level, and a plurality of terminals connected to the second portion. The semiconductor power module further includes a power circuit mounted on a first surface of the first portion and an insulator having an electrically insulating property and thermal conductivity. The insulator has a first surface adjacent to a second surface of the first portion, and a second surface opposite to the first surface of the insulator and exposed to the outside. The semiconductor power module further includes a sealer having an electrically insulating property that covers the power circuit.
    Type: Application
    Filed: January 6, 2006
    Publication date: June 1, 2006
    Inventors: Gi-Young Jeun, O-Seob Jeun, Eun-Ho Lee, Seung-Won Lim