Patents by Inventor Ochi Kentaro

Ochi Kentaro has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF
    Publication number: 20110089558
    Abstract: There is provided a technology capable of reducing the mounting burden on the part of a customer which is a recipient of a package. Over a metal board, a single package and another single package are mounted together via an insulation adhesion sheet, thereby to form one composite package. As a result, as compared with the case where six single packages are mounted, the number of packages to be mounted is smaller in the case where three sets of the composite packages are mounted. This can reduce the mounting burden on the part of a customer.
    Type: Application
    Filed: October 17, 2010
    Publication date: April 21, 2011
    Inventors: Akira MUTO, Akira Mishima, Takuro Kanazawa, Ochi Kentaro, Tetsuo Iijima, Katsuo Ishizaka