Patents by Inventor Octavio I. Chirino

Octavio I. Chirino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayer ceramic substrate structure
    Patent number: 3999004
    Abstract: This is a microelectronic multilayer circuit structure having circuit compatibility encapsulated within the circuit package including conductive electrical interconnection means formed by uniquely metallizing the "via" and/or blind interconnection holes within the circuit package. The assembly process provides means of uniformly metallizing the interlayer connecting holes.
    Type: Grant
    Filed: September 27, 1974
    Date of Patent: December 21, 1976
    Assignee: International Business Machines Corporation
    Inventors: Octavio I. Chirino, Joseph Hromek, Kailash C. Joshi, George C. Phillips, Jr.