Patents by Inventor Odd Robert Steijer

Odd Robert Steijer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9791647
    Abstract: An optoelectronic module is disclosed. The optoelectronic module comprises an optical connector, a contact, an opto-electric assembly, and a casing. The opto-electric assembly has a carrier optically connected to the optical connector by a flexible optical fiber and electrically connected to the contact by a flexible cable. The casing at least partially encloses the opto-electric assembly, the optical connector, and the contact. An inner surface of a wall of the casing is attached to the carrier in a thermally conductive manner.
    Type: Grant
    Filed: July 7, 2016
    Date of Patent: October 17, 2017
    Assignee: Tyco Electronics Svenska Holdings AB
    Inventors: Odd Robert Steijer, Magnus Andersson
  • Patent number: 9651749
    Abstract: An interposer comprising a substrate having at least a top surface and a bottom surface, the top and bottom surfaces being substantially parallel; at least one series of bottom cavities on the bottom surface; at least one expansion cavity contiguous with the at least one series of bottom cavities, the at least one expansion cavity being larger than each of the bottom cavities; a perimeter defined on the bottom surface around the bottom cavities; at least one alignment fiducial on the top surface for cooperating with a corresponding fiducial on the detachable optical interface to optically couple an optical conduit attached to the detachable optical interface with at least one optical device; and the at least one optical device mounted to the substrate on at least a portion of the perimeter, the optical device configured to emit a diverging light beam or receive a non-diverging light beam.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: May 16, 2017
    Assignee: Tyco Electronics Svenska Holdings AB
    Inventors: Odd Robert Steijer, Hans Magnus Emil Andersson
  • Publication number: 20170023751
    Abstract: An optoelectronic module is disclosed. The optoelectronic module comprises an optical connector, a contact, an opto-electric assembly, and a casing. The opto-electric assembly has a carrier optically connected to the optical connector by a flexible optical fiber and electrically connected to the contact by a flexible cable. The casing at least partially encloses the opto-electric assembly, the optical connector, and the contact. An inner surface of a wall of the casing is attached to the carrier in a thermally conductive manner.
    Type: Application
    Filed: July 7, 2016
    Publication date: January 26, 2017
    Applicant: Tyco Electronics Svenska Holdings AB
    Inventors: Odd Robert Steijer, Magnus Andersson
  • Patent number: 8232142
    Abstract: Disclosed is a carrier assembly for and a method of manufacturing an optical device. The method comprises providing a silicon substrate; attaching a number of optical dies on the silicon substrate to form an optical device carrier assembly; providing a corresponding number of through holes in the silicon substrate to permit the passage of light therethrough and further providing guide holes in the silicon substrate to present means for passive alignment of an external optical connection; and dicing the optical device carrier assembly to form individual optical devices. Preferably, the step of attaching a number of optical dies comprises using self-alignment of solder bumps using gaseous flux, the through holes are dry etched into the silicon substrate, and/or the volume between the optical die and silicon substrate is filled with a transparent polymer. Preferably, the transparent polymer is silicone rubber or epoxy.
    Type: Grant
    Filed: September 14, 2009
    Date of Patent: July 31, 2012
    Assignee: Tyco Electronics Services GmbH
    Inventors: Odd Robert Steijer, Hans Magnus Emil Andersson
  • Patent number: 7978940
    Abstract: Broadly speaking, disclosed is a carrier assembly for an optical device, the carrier assembly comprising in combination: a glass substrate with an optical die thereon; and a silicon carrier attached to the glass carrier. During manufacture, a number of optical dies can be attached on the glass substrate using self-alignment of AuSn solder bumps using gaseous flux at about 300 deg C. The glass carrier can be mounted to the silicon carrier to form an optical device carrier assembly comprising micromechanical guide holes to facilitate a optical fiber connection, using self-alignment of SnAg solder bumps using gaseous flux at about 250 deg C. Each individual optical device can be tested at a wafer scale. The resulting optical device assembly can be diced to form individual optical devices having a carrier assembly that exhibits the traits of both a silicon carrier and a glass carrier.
    Type: Grant
    Filed: September 14, 2009
    Date of Patent: July 12, 2011
    Assignee: Tyco Electronics Services GmbH
    Inventors: Odd Robert Steijer, Hans Magnus Emil Andersson
  • Publication number: 20110091168
    Abstract: There is provided an opto-electrical assembly. The assembly comprises an optical carrier and one or more optical elements and possibly also electrical elements, such as optical flip-chip die, attached to the optical carrier, and configured for electrical and optical communication with the optical carrier. The assembly further comprises a flexible electrical and optical connectors attached to the optical carrier, and configured to provide electrical and optical communication between the one or more optical and electrical elements and further circuitry. Wherein the flexible connectors are configured to allow for relative movement of the optical carrier and further circuitry during use of the assembly.
    Type: Application
    Filed: October 19, 2009
    Publication date: April 21, 2011
    Applicant: ZARLINK SEMICONDUCTOR AB
    Inventors: Odd Robert Steijer, Hans Magnus Emil Andersson, Maria Elisabeth Kãllén
  • Publication number: 20110089438
    Abstract: Provided is a method of providing an opto-electrical assembly. The method comprises attaching a second electrical element to a carrier using a second attachment region at a second attaching temperature. The second attaching temperature is associated with the melting temperature of the second attachment region, such as the melting temperature of solder or the like. The carrier already comprises a first opto-electrical element having been attached to the carrier using a first attachment region at a first attaching temperature, whereby the first attaching temperature is associated with the melting temperature of the first attachment region. The method is provided such that the second attachment region has a lower melting temperature than the first attachment region such that the second attaching temperature is lower than the first attaching temperature.
    Type: Application
    Filed: October 19, 2009
    Publication date: April 21, 2011
    Applicant: ZARLINK SEMICONDUCTOR AB
    Inventors: Odd Robert Steijer, Hans Magnus Emil Andersson, Asa Christina Johansson, Lennart Per Olof Lundqvist, Sylvia Anna-Karin Ek, Maria Elisabeth Källén
  • Publication number: 20110062572
    Abstract: Disclosed is a carrier assembly for and a method of manufacturing an optical device. The method comprises providing a silicon substrate; attaching a number of optical dies on the silicon substrate to form an optical device carrier assembly; providing a corresponding number of through holes in the silicon substrate to permit the passage of light therethrough and further providing guide holes in the silicon substrate to present means for passive alignment of an external optical connection; and dicing the optical device carrier assembly to form individual optical devices. Preferably, the step of attaching a number of optical dies comprises using self-alignment of solder bumps using gaseous flux, the through holes are dry etched into the silicon substrate, and/or the volume between the optical die and silicon substrate is filled with a transparent polymer. Preferably, the transparent polymer is silicone rubber or epoxy.
    Type: Application
    Filed: September 14, 2009
    Publication date: March 17, 2011
    Applicant: ZARLINK SEMICONDUCTOR AB
    Inventors: Odd Robert Steijer, Hans Magnus Emil Andersson
  • Publication number: 20110064363
    Abstract: Broadly speaking, disclosed is a carrier assembly for an optical device, the carrier assembly comprising in combination: a glass substrate with an optical die thereon; and a silicon carrier attached to the glass carrier. During manufacture, a number of optical dies can be attached on the glass substrate using self-alignment of AuSn solder bumps using gaseous flux at about 300 deg C. The glass carrier can be mounted to the silicon carrier to form an optical device carrier assembly comprising micromechanical guide holes to facilitate a optical fiber connection, using self-alignment of SnAg solder bumps using gaseous flux at about 250 deg C. Each individual optical device can be tested at a wafer scale. The resulting optical device assembly can be diced to form individual optical devices having a carrier assembly that exhibits the traits of both a silicon carrier and a glass carrier.
    Type: Application
    Filed: September 14, 2009
    Publication date: March 17, 2011
    Applicant: ZARLINK SEMICONDUCTOR AB
    Inventors: Odd Robert Steijer, Hans Magnus Emil Andersson