Patents by Inventor Oded Meirav

Oded Meirav has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic packaging and method of making the same
    Publication number: 20060092615
    Abstract: An interconnect structure for use in an electronic device, wherein the interconnect structure comprises a first substrate comprising a flexible material, wherein the first substrate comprises a front side and a back side, and wherein the first substrate is configured to receive a sensor on the front side; and a second substrate coupled to the back side of the first substrate and comprising a rigid material. A detector module for use in an imaging system comprises the aforementioned interconnect structure.
    Type: Application
    Filed: October 28, 2004
    Publication date: May 4, 2006
    Inventors: William Burdick, James Rose, John Tkaczyk, Oded Meirav, Jerome Arenson, David Hoffman