Abstract: Data storage systems may include a chassis with a first end and a second end. One or more fans may be positioned at the first end of the chassis. At least one storage media device may be positioned inside the chassis and behind the at least one fan relative to the first end of the chassis. A carrier including a frame may be coupled to the at least one storage media device, where the frame includes an elongated member extending away from the storage media device toward the first end of the chassis. Other aspects, embodiments, and features are also included.

Abstract: According to an aspect a perch is provided comprising a bracket configured to be attached to a rack-mount component, a bar having a width and an elongated surface, the bar having tabs configured to engage with the bracket, and an attachment screw to secure the bar to the bracket so that the bar extends horizontally across a portion of the component.

Abstract: One feature pertains to an acoustic attenuation device. The acoustic attenuation device comprises a fan assembly, the fan assembly including at least one fan module that directs airflow in at least one direction, wherein the at least one fan module includes a top surface and a bottom surface, a plurality of air deflectors mounted to the top surface and the bottom surface of the at least one fan module, wherein the plurality of air deflectors include a plurality of surfaces, and wherein at least one of the plurality of surfaces is an angled surface that redirects the airflow 90-degrees, and acoustic attenuating foam, wherein the acoustic attenuating foam has a two-dimensional (2-D) surface and is applied to interior surfaces of the plurality of surfaces.

Abstract: One feature pertains to a data storage cooling module. The data storage cooling module comprises a fan cage assembly, the fan cage assembly including a fan cage that includes at least one fan bay, at least one fan assembly removably coupled to the at least one fan bay, and an interface board removably coupled to the fan cage assembly, the interface board including a first interface surface that includes at least one power connector configured to interface with the at least one fan assembly, and a second interface surface that includes at least one drive connector configured to interface with a baseboard.

Abstract: One feature pertains to an acoustic attenuation device. The acoustic attenuation device comprises a fan assembly, the fan assembly including at least one fan module that directs airflow in at least one direction, wherein the at least one fan module includes a top surface and a bottom surface, a plurality of air deflectors mounted to the top surface and the bottom surface of the at least one fan module, wherein the plurality of air deflectors include a plurality of surfaces, and wherein at least one of the plurality of surfaces is an angled surface that redirects the airflow 90-degrees, and acoustic attenuating foam, wherein the acoustic attenuating foam has a two-dimensional (2-D) surface and is applied to interior surfaces of the plurality of surfaces.

Abstract: One feature pertains to a data storage cooling module. The data storage cooling module comprises a fan cage assembly, the fan cage assembly including a fan cage that includes at least one fan bay, at least one fan assembly removably coupled to the at least one fan bay, and an interface board removably coupled to the fan cage assembly, the interface board including a first interface surface that includes at least one power connector configured to interface with the at least one fan assembly, and a second interface surface that includes at least one drive connector configured to interface with a baseboard.

Abstract: One feature pertains to an acoustic attenuation device. The acoustic attenuation device comprises a fan assembly, the fan assembly including at least one fan module that directs airflow in at least one direction, wherein the at least one fan module includes a top surface and a bottom surface, a plurality of air deflectors mounted to the top surface and the bottom surface of the at least one fan module, wherein the plurality of air deflectors include a plurality of surfaces, and wherein at least one of the plurality of surfaces is an angled surface that redirects the airflow 90-degrees, and acoustic attenuating foam, wherein the acoustic attenuating foam has a two-dimensional (2-D) surface and is applied to interior surfaces of the plurality of surfaces.

Abstract: An input/output module (IOM) for use within a network storage system mounted within a rack enclosure. The IOM includes a switching component configured to provide top-of-rack (TOR) switching for data to be routed from input connectors to data storage devices within the rack enclosure. The IOM also includes a protocol interface configured to convert a protocol of the data from an input data protocol (e.g., Ethernet, Fibre Channel or InfiniBand™) to a protocol for use with the storage devices (e.g., nonvolatile memory express (NVMe) and Peripheral Component Interconnect Express (PCIe)). Among other features, the IOM allows switching to be dis-aggregated from a TOR switch and distributed throughout the data network of the rack.

Abstract: A data storage array has a backplane at the base of an enclosure. A plurality of data storage drives are coupled to connectors of the backplane. A hot-swappable protocol expander module is coupled between the drives and the backplane through a top of the enclosure or to the backplane through a side of the enclosure.

Abstract: A data storage array has a backplane at the base of an enclosure. A plurality of data storage drives are coupled to connectors of the backplane. A hot-swappable protocol expander module is coupled between the drives and the backplane through a top of the enclosure or to the backplane through a side of the enclosure.

Abstract: An enclosure has a sidewall with a step that results in an upper part of the sidewall extending over a slide mounting region. A backplane is located at a base of the enclosure and is configured to receive a plurality of data storage drives. A circuit carrier extends from the backplane to the step in the side of the enclosure. The circuit carrier has one or more connectors proximate an upper surface of the step and is configured to receive one or more expansion modules that expand a functionality of the backplane.

Abstract: An enclosure services processor card is arranged to selectively split a fiber-channel arbitrated-loop (FC-AL) into two split loops. The card is adapted to plug into a backplane for a rack enclosure and includes a first switch operatively connected to a hub for the FC-AL. The hub comprises a plurality of port bypass circuits, each port bypass circuit being connected to a pair of tracks which in use connect to a respective one of each of the devices comprising the fiber channel arbitrated loop. The hub further comprises a pair of switches operatively controlled by the first switch, the pair of switches being disposed between respective port bypass circuits at which the loop is to be split. In a first state the pair of switches connect the devices in a single loop and in a second state the pair of switches divide the devices into two split loops.