Abstract: An SMT electronic component is mounted to a solder-bearing floatation plate by fusible or other heat-responsive releasable mounting means which suspend the component above the floatation plate. The bottom of the floatation plate is effectively substantially the mirror image of a component-positioning pad formed on the board surface adjacent the solder-bearing contact pads corresponding to the electrical contacts on the component. In the assembly process, the floatation plate is placed on the positioning pad. The solder on the bottom of the floatation plate has a melting point lower than the release temperature of the mounting means and the melting point of the solder on the contact pads. With the floatation plate on the component-positioning pad, on heating the solder on the floatation plate liquifies first, wetting the component-positioning pad and floating the floatation plate and component on a thin film of molten solder.