Abstract: A computer system includes a processor module comprising a vapor chamber heat spreader for removing heat from a bare die processor. The vapor chamber heat spreader may be coupled with the bare die processor via a mounting structure. The vapor chamber heat spreader may have a pedestal that extends towards the bare die processor, such that a bottom surface of the pedestal is positioned proximate a top surface of the bare die processor. In various embodiments, the processor module may be configured to enable servicing of one or more components. For example, the processor module may have a mechanism that allows for uncoupling the vapor chamber heat spreader from the bare die processor, so as to enable replacement of the bare die processor in some embodiments.