Abstract: A solid-state image pickup device includes a pixel unit configured to convert light into an electrical signal; a substrate having a first side on which the pixel unit is formed and a second side opposite the first side; an optical communication unit disposed on the first side of the substrate, and configured to convert a signal read out from the pixel unit into an optical signal and output the optical signal; and a cooling unit disposed on the second side of the substrate and below at least a forming area of the optical communication unit, the forming area being an area where the optical communication unit is formed, and configured to cool or dissipate heat generated in the optical communication unit and transferred through the substrate.

Abstract: A solid-state imaging device includes: a pixel section formed on a substrate and having an effective pixel area that converts incident light into an electric signal, and an optical black area placed around the effective pixel area; an optical communication section placed near a predetermined optical black area of the optical black area, and converts a signal read from the pixel section into an optical signal for output; a dark current level supplying section that generates an estimated dark current level varying with a pixel position from which a signal is read, on the basis of a dark current level acquired from the predetermined optical black area, and outputs the estimated dark current level in synchronization with a signal read timing from the effective pixel area; and a noise compensation section that subtracts the estimated dark current level from a signal read from the effective pixel area.