Patents by Inventor Ogura ICHIRO

Ogura ICHIRO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20170094773
    Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board may include a core layer, a metal layer disposed on the core layer, and a heat dissipation unit disposed to pass through the core layer in across a thickness of the core layer.
    Type: Application
    Filed: July 21, 2016
    Publication date: March 30, 2017
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Il-Jong SEO, Ogura ICHIRO, Myung-Sam KANG, Tae-Hong MIN