Abstract: A power semiconductor package includes a first substrate assembly with a power semiconductor die defining a high-side power switch, a second substrate assembly arranged parallel to the first substrate assembly which has a power semiconductor die defining a low-side power switch, and a power terminal assembly. The power terminal assembly includes a power terminal substrate arranged between the first and the second substrate assembly, a high-side drain power terminal electrically connected to an electrical drain circuit of the high-side power switch, a low-side source power terminal electrically connected to an electrical source circuit of the low-side power switch, and a mid-point power terminal electrically connected to an electrical source circuit of the high-side power switch and to an electrical drain circuit of the low-side power switch. The high-side drain power terminal, the low-side source power terminal, and the mid-point power terminal are each arranged on the power terminal substrate.

Abstract: Methods, systems, and devices supporting data processing are described. In some systems, a user device may receive an indication to aviate an in-line view of a data record from a data platform that is external to a document editing client. A server running the document editing client may query the external data platform for a value of a field of the data record based on the received indication to activate the in-line view. The server, the user device, or both may cause the value to be displayed within the document editing client in an in-line position at which the indication to activate the in-line view is received.