Patents by Inventor Oh Choon KWON

Oh Choon KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solid electrolyte capacitor and fabrication method thereof
    Patent number: 11521801
    Abstract: A solid electrolyte capacitor includes a sintered body formed by sintering a molded body containing metal powder; and a conductive polymer layer disposed above the sintered body. A ratio (t2/t1) of a thickness (t2) of the conductive polymer layer in an edge portion of the sintered body to a thickness (t1) of the conductive polymer layer in a central portion of the sintered body satisfies 0.35?t2/t1?0.9.
    Type: Grant
    Filed: May 19, 2020
    Date of Patent: December 6, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Ho Hong, Youn Soo Kim, Oh Choon Kwon, Hyun Sub Oh
  • SOLID ELECTROLYTE CAPACITOR AND FABRICATION METHOD THEREOF
    Publication number: 20210166886
    Abstract: A solid electrolyte capacitor includes a sintered body formed by sintering a molded body containing metal powder; and a conductive polymer layer disposed above the sintered body. A ratio (t2/t1) of a thickness (t2) of the conductive polymer layer in an edge portion of the sintered body to a thickness (t1) of the conductive polymer layer in a central portion of the sintered body satisfies 0.35?t2/t1?0.9.
    Type: Application
    Filed: May 19, 2020
    Publication date: June 3, 2021
    Inventors: Jin Ho Hong, Youn Soo Kim, Oh Choon Kwon, Hyun Sub Oh
  • Composite electronic component, board having the same, and power smoother including the same
    Patent number: 10008340
    Abstract: A composite electronic component includes a composite body formed by combining a multilayer ceramic capacitor (MLCC) and a tantalum capacitor. The composite electronic component has an excellent acoustic noise reduction effect, low equivalent series resistance (ESR)/equivalent series inductance (ESL), enhanced DC-bias characteristics, and a reduced chip thickness.
    Type: Grant
    Filed: June 5, 2015
    Date of Patent: June 26, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Young Ghyu Ahn, Byoung Hwa Lee, Sang Soo Park, Oh Choon Kwon, Hong Kyu Shin, Hyun Sub Oh, Jae Hyuk Choi
  • COMPOSITE ELECTRONIC COMPONENT, BOARD HAVING THE SAME, AND POWER SMOOTHER INCLUDING THE SAME
    Publication number: 20160020041
    Abstract: A composite electronic component includes a composite body formed by combining a multilayer ceramic capacitor (MLCC) and a tantalum capacitor. The composite electronic component has an excellent acoustic noise reduction effect, low equivalent series resistance (ESR)/equivalent series inductance (ESL), enhanced DC-bias characteristics, and a reduced chip thickness.
    Type: Application
    Filed: June 5, 2015
    Publication date: January 21, 2016
    Inventors: Young Ghyu AHN, Byoung Hwa LEE, Sang Soo PARK, Oh Choon KWON, Hong Kyu SHIN, Hyun Sub OH, Jae Hyuk CHOI