Patents by Inventor Oh Guk KWON

Oh Guk KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250069971
    Abstract: A semiconductor package comprises a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, at least one connection bump between the first semiconductor chip and the second semiconductor chip, an underfill in a region below the second semiconductor chip and on a side of the at least one connection bump and a molding layer on the first semiconductor chip and on a side of the second semiconductor chip, wherein an upper surface of the second semiconductor chip is above an upper surface of the molding layer, a height difference between the upper surface of the second semiconductor chip and the upper surface of the molding layer is 0.3 ?m to 2.0 ?m, and a surface roughness of the upper surface of the second semiconductor chip is 3 nm or less.
    Type: Application
    Filed: April 1, 2024
    Publication date: February 27, 2025
    Inventors: Yong Hoe CHO, Oh Guk KWON, Sun Jae KIM, Hui Yeong JANG
  • Publication number: 20240234275
    Abstract: Provided is a semiconductor package including a printed circuit board (PCB) substrate, a silicon substrate on the PCB substrate, a plurality of through vias penetrating the silicon substrate, a plurality of pads on the silicon substrate and connected to at least some of the plurality of through vias, a semiconductor chip on the plurality of pads and electrically connected to the plurality of pads, and a plurality of connecting terminals between the semiconductor chip and the plurality of pads, wherein the plurality of pads include a first pad that includes a trench and a second pad, and wherein the plurality of connecting terminals include a first connecting terminal connected to the first pad, at least a part of the first connecting terminal being in the trench and a remaining part of the first connecting terminal being on the first pad, and a second connecting terminal connected to the second pad.
    Type: Application
    Filed: December 19, 2023
    Publication date: July 11, 2024
    Applicant: SAMSUNG ELECTRONICS CO, LTD.
    Inventors: Hui Yeong JANG, Oh Guk KWON, Sun Jae KIM, Jeong Oh HA
  • Publication number: 20210330211
    Abstract: Disclosed is an exercise guidance system using an electromyography sensor, the system including: a control server receiving exercise information by working in conjunction with a monitoring module, in which an exercise guidance application is installed, over a wired/wireless communication network, the control server providing analysis information on user's exercise; and a signal processing module receiving detection signals from multiple electromyography sensors attached on a user body, calculating muscle activity by analyzing the detection signals, and providing a result of the calculation to the monitoring module. According to the embodiment, the cost burden of personal training is reduced, and the monotony of exercising along is reduced. Also, there is no limitation of place and time because exercise is possible anywhere.
    Type: Application
    Filed: June 29, 2017
    Publication date: October 28, 2021
    Inventors: Hyung Seob HAN, Kyoung Young SONG, Oh Guk KWON, Tae Young KIM