Patents by Inventor Oh-Sang Cho

Oh-Sang Cho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for etching edge of wafer
    Patent number: 8349126
    Abstract: An apparatus for etching an edge of a wafer includes a chamber, a chuck disposed inside the chamber upon which the wafer is disposed, a plate spaced apart from the wafer and disposed above the wafer, and an edge ring formed along the edge of the wafer and combined with an outer periphery of the plate, wherein the edge ring comprises a ring base spaced a distance apart from the wafer to form a parallel plane with respect to the wafer, and a first ring protrusion protruding from the ring base to insulate the edge of the wafer from a central region of the wafer.
    Type: Grant
    Filed: February 23, 2010
    Date of Patent: January 8, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Chong-Kwang Chang, Oh-Sang Cho, In-Keun Lee, Hyo-Jeong Kim
  • Apparatus for Etching Edge of Wafer
    Publication number: 20100212833
    Abstract: An apparatus for etching an edge of a wafer includes a chamber, a chuck disposed inside the chamber upon which the wafer is disposed, a plate spaced apart from the wafer and disposed above the wafer, and an edge ring formed along the edge of the wafer and combined with an outer periphery of the plate, wherein the edge ring comprises a ring base spaced a distance apart from the wafer to form a parallel plane with respect to the wafer, and a first ring protrusion protruding from the ring base to insulate the edge of the wafer from a central region of the wafer.
    Type: Application
    Filed: February 23, 2010
    Publication date: August 26, 2010
    Inventors: Chong-Kwang Chang, Oh-Sang Cho, In-Keun Lee, Hyo-Jeong Kim