Abstract: An electrode sheet drying equipment, an electrode sheet manufacturing system including the same, and an electrode sheet drying method including an air-floating roller disposed downstream of a drying oven, and the air-floating roller is configured to spray hot air through multiple air spraying holes formed on the outer circumferential surface. Accordingly, the electrode sheet discharged from the drying oven in a partially undried state can be additionally dried, thereby preventing contamination of a transfer roller and/or equipment of the subsequent process.

Abstract: An infrared heat source module is configured to minimize problems such as wrinkles or cracks in electrodes even if the patterns of a coated part and an uncoated part of the electrodes present in a current collector vary. The module improves a drying efficiency of the coated part of the current collector. An electrode using the infrared heat source module is manufactured by a process.

Abstract: An electrode manufacturing apparatus includes a supply part to supply an electrode precursor, a drying part to dry the electrode slurry, an air supply part to supply high-temperature vapor, an air introducing part to introduce the supplied high-temperature vapor, a flow path connected from the air introducing part to the air supply part, a sensor to measure humidity, an air discharge part, and a humidifying part to humidify the high-temperature vapor. The apparatus further includes a discharge part to discharge the manufactured electrode, a monitoring part, and a control part to collect monitoring information and information on the humidity to control whether to open or close the air discharge part and a degree of humidification by the humidifying part. An electrode manufacturing method using the apparatus thereof.

Abstract: An embodiment vehicle hinge driving apparatus includes an actuator, a housing connected to the actuator, an output shaft rotatably mounted in the housing, and a transmission mechanism including a plurality of gear sets configured to transmit a torque from the actuator to the output shaft, wherein the plurality of gear sets includes a proximal gear set close to the actuator, a first distal gear set operatively connected to the proximal gear set, and a second distal gear set operatively connected to the first distal gear set, wherein the second distal gear set is detachably mounted and configured to respond to a required output torque, and wherein the output shaft is connected to the first distal gear set or the second distal gear set.

Abstract: An embodiment vehicle hinge driving apparatus includes an actuator, a housing connected to the actuator, an output shaft rotatably mounted in the housing, a transmission mechanism configured to transmit a torque from the actuator to the output shaft, and a brake unit mounted on the transmission mechanism. An embodiment method for providing a vehicle hinge driving apparatus includes rotatably mounting an output shaft in a housing that is connected to an actuator, providing a transmission mechanism that transmits a torque from the actuator to the output shaft, and mounting a brake unit on the transmission mechanism.

Abstract: A semiconductor chip package includes a semiconductor chip, a lead frame including a plurality of inner leads each having a wire bonding point on a top surface, bonding wires for electrically interconnecting the semiconductor chip to each of the plurality of inner leads, and a molding compound for encapsulating the semiconductor chip and the inner leads. Each of the plurality of inner leads of the lead frame has a means for locking movement of the molding compound against the top surfaces of the inner leads, and the locking means, for example a linear groove, down set feature of the inner lead or second wire ball, is placed in close proximity to the wire bonding.

Abstract: A semiconductor chip package comprises leads which protrude from one side of a package body, and support portions which are formed at both ends of the package body on either side of the leads for firmly mounting the package on a printed circuit board (PCB). The support portions are made of a same material as the package body. At the package body, a slot is formed to further protect the leads, and the leads are alternately formed to mount the packages close by. Thus, there is no additional process step for forming holes in the PCB to mount the support portions of the semiconductor package, so the mounting process of the package becomes simpler. The support portions which protrude from the package body permit the package to be mounted on the PCB firmly. The slot and support portions protect the leads and prevent the leads from being deformed by external forces, thereby improving the reliability of the semiconductor package.