Abstract: A method for processing missing values of network log data and a method for classifying communication defect root cause thereof, includes utilizing machine learning or deep learning techniques to analyze the root causes of various defects occurring in a network environment while obtaining a complete dataset by obtaining appropriate imputation values according to the characteristics of the parameters in which the missing values exist.

Abstract: A heater system for a pipe for controlling a temperature of a heater installed to surround a pipe and performing a heating or insulation function.

Abstract: A heater for a pipe, includes a heater body part having a longitudinal cutting line formed in the entire thickness section to form a pair of longitudinal cutting planes in the entire length section, a heating wire installed in the heater body part, and a restraint operating part installed at the heater body part and restraining the pair of longitudinal cutting planes not to be spaced apart from each other. Each of the longitudinal cutting planes includes: a longitudinal outer cutting area disposed in a thickness direction from an outer surface of the heater body part, a longitudinal intermediate cutting area extending from the longitudinal outer cutting area in a circumferential direction of the heater body part, and a longitudinal inner cutting area extending from the longitudinal intermediate cutting area to reach the inner surface of the heater body part in the thickness direction of the heater body part.

Abstract: A heater system for a pipe for controlling a temperature of a heater installed to surround a pipe and performing a heating or insulation function.

Abstract: Disclosed herein is an apparatus for sensing a wafer loading state using a sound wave sensor, including: a wafer loading part into which a wafer is loaded or unloaded along a slot; a sound wave sensor installed to be spaced apart from the slot, and sensing a contact sonic wave generated due to contact when the wafer is loaded or unloaded to generate real-time waveform information; and a control module confirming whether the wafer is normally loaded into the slot, wherein the control module includes: a control reception part receiving the real-time waveform information; a control memory in which a look-up table including look-up waveform information is stored; and a control determination part determining whether the wafer is normally loaded by comparing the real-time waveform information with the look-up waveform information.

Abstract: Disclosed herein is an identifier based communication system including: a common communication path; a center station having a center station communication module and a center station controller connected to the center station communication module and connected to the common communication path through the center station communication module; and a plurality of distribution stations each including a distribution station communication module connected to the common communication path, a distribution station controller connected to the distribution station communication module, and a distribution station memory connected to the distribution station controller and storing a determined identifier value of the distribution station, wherein the center station controller transmits an identifier setting mode command including a center transmission preliminary identifier value to the distribution stations following an identifier setting request input from the outside; each of the distribution stations includes a distri

Abstract: A utility box which includes a concave-shaped box having a box opening on a top end of the box and a cover plate installed on the box to cover the box opening. The box has a box body, a box shoulder, and a box opening formed on the top end of the box. A pair of lower horizontal guide surfaces are disposed parallel to each other. The box shoulder has a shoulder body and a pair of upper horizontal guide surfaces. A cover plate is formed to have a cover plate wide width portion and is installed in such a manner that the cover plate wide width portion is supported on the lower horizontal guide surfaces. A cover plate opening/closing support controls the cover plate. The box body has improved inner space utilization and a region of its cover plate has a simple structure.

Abstract: A heater for a pipe, includes a heater body part having a longitudinal cutting line formed in the entire thickness section to form a pair of longitudinal cutting planes in the entire length section, a heating wire installed in the heater body part, and a restraint operating part installed at the heater body part and restraining the pair of longitudinal cutting planes not to be spaced apart from each other. Each of the longitudinal cutting planes includes: a longitudinal outer cutting area disposed in a thickness direction from an outer surface of the heater body part, a longitudinal intermediate cutting area extending from the longitudinal outer cutting area in a circumferential direction of the heater body part, and a longitudinal inner cutting area extending from the longitudinal intermediate cutting area to reach the inner surface of the heater body part in the thickness direction of the heater body part.

Abstract: Disclosed herein is an identifier based communication system including: a common communication path; a center station having a center station communication module and a center station controller connected to the center station communication module and connected to the common communication path through the center station communication module; and a plurality of distribution stations each including a distribution station communication module connected to the common communication path, a distribution station controller connected to the distribution station communication module, and a distribution station memory connected to the distribution station controller and storing a determined identifier value of the distribution station, wherein the center station controller transmits an identifier setting mode command including a center transmission preliminary identifier value to the distribution stations following an identifier setting request input from the outside; each of the distribution stations includes a distri

Abstract: Disclosed is a pipe heater comprising a tubular heat insulating layer having a pair of separating surfaces formed over the entire length thereof, an external cover bonded to the outer surface of the heat insulating layer to enclose the heat insulating layer, a heating layer provided inside the heat insulating layer and including a heating wire therein, and an internal cover provided inside the heating layer to enclose the heating layer, wherein the heat insulating layer includes a polyimide foam layer formed of polyimide foam, and a protection layer is interposed between the heat insulating layer and the heating wire to prevent bubbles distributed in the polyimide foam layer from dissipating due to heat transferred from the heating wire.

Abstract: Disclosed is a chemical-mechanical wafer polishing device having an elastic membrane including a circular action plate portion, a membrane circumferential wall portion extending from a circumferential edge of the action plate portion along a direction perpendicular to a plate surface, and a chamber formed between the action plate portion and the membrane circumferential wall portion. The membrane includes a cooling channel portion having an action plate bottom surface section, and a supply penetration section penetrating the action plate portion such that one end is connected to the action plate bottom surface section and the other end is exposed to the upper side of the action plate portion. The chemical-mechanical wafer polishing device includes a cooling fluid supply portion having a cooling fluid supply tube connected to a free end of the supply penetration section, and providing a cooling fluid to the cooling channel portion.

Abstract: Disclosed is a chemical-mechanical wafer polishing device having an elastic membrane including a circular action plate portion, a membrane circumferential wall portion extending from a circumferential edge of the action plate portion along a direction perpendicular to a plate surface, and a chamber formed between the action plate portion and the membrane circumferential wall portion. The membrane includes a cooling channel portion having an action plate bottom surface section, and a supply penetration section penetrating the action plate portion such that one end is connected to the action plate bottom surface section and the other end is exposed to the upper side of the action plate portion. The chemical-mechanical wafer polishing device includes a cooling fluid supply portion having a cooling fluid supply tube connected to a free end of the supply penetration section, and providing a cooling fluid to the cooling channel portion.

Abstract: Disclosed is a pipe heater comprising a tubular heat insulating layer having a pair of separating surfaces formed over the entire length thereof, an external cover bonded to the outer surface of the heat insulating layer to enclose the heat insulating layer, a heating layer provided inside the heat insulating layer and including a heating wire therein, and an internal cover provided inside the heating layer to enclose the heating layer, wherein the heat insulating layer includes a polyimide foam layer formed of polyimide foam, and a protection layer is interposed between the heat insulating layer and the heating wire to prevent bubbles distributed in the polyimide foam layer from dissipating due to heat transferred from the heating wire.

Abstract: Provided are a carrier head and a carrier head unit for sucking and securely supporting a substrate during a chemical mechanical polishing process. The carrier head using sucking force to fix a substrate includes a head main body that includes a receiving space in a central portion thereof, the receiving space being opened downward to receive the substrate, a housing part in an edge thereof to surround a side portion of the receiving space, a main passage passing through the head main body to communicate with the receiving space, and a plurality of connecting holes vertically passing through the housing part to communicate with the main passage, a retaining ring coupled to a bottom surface of the housing part of the head main body to close lower portions of the connecting holes, and a cover coupled to a top surface of the head main body to close upper portions of the connecting holes.

Abstract: Provided are a carrier head and a carrier head unit for sucking and securely supporting a substrate during a chemical mechanical polishing process. The carrier head using sucking force to fix a substrate includes a head main body that includes a receiving space in a central portion thereof, the receiving space being opened downward to receive the substrate, a housing part in an edge thereof to surround a side portion of the receiving space, a main passage passing through the head main body to communicate with the receiving space, and a plurality of connecting holes vertically passing through the housing part to communicate with the main passage, a retaining ring coupled to a bottom surface of the housing part of the head main body to close lower portions of the connecting holes, and a cover coupled to a top surface of the head main body to close upper portions of the connecting holes.