Patents by Inventor Oh Sug Kim
Oh Sug Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9786827Abstract: A light-emitting diode package includes a package body. The package body includes an upper insulation substrate including upper conductive patterns, a lower insulation substrate including lower conductive patterns, and middle conductive patterns disposed between the upper insulation substrate and the lower insulation substrate. The package body also includes an upper via disposed in the upper insulation substrate, a lower via disposed in the lower insulation substrate, the upper via and the lower via not overlaid with each other.Type: GrantFiled: September 30, 2016Date of Patent: October 10, 2017Assignee: Seoul Semiconductor Co., Ltd.Inventors: Jung Hwa Jung, Hee Tak Oh, Do Hyung Kim, You Jin Kwon, Oh Sug Kim
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Publication number: 20170018696Abstract: A light-emitting diode package includes a package body. The package body includes an upper insulation substrate including upper conductive patterns, a lower insulation substrate including lower conductive patterns, and middle conductive patterns disposed between the upper insulation substrate and the lower insulation substrate. The package body also includes an upper via disposed in the upper insulation substrate, a lower via disposed in the lower insulation substrate, the upper via and the lower via not overlaid with each other.Type: ApplicationFiled: September 30, 2016Publication date: January 19, 2017Inventors: Jung Hwa JUNG, Hee Tak OH, Do Hyung KIM, You Jin KWON, Oh Sug KIM
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Patent number: 9472743Abstract: A light-emitting diode package includes a package body and a light-emitting diode chip disposed on the package body. The package body includes upper conductive patterns disposed on an upper insulation substrate, a lower insulation substrate disposed on lower conductive patterns, and middle conductive patterns disposed between the upper insulation substrate and the lower insulation substrate. The package body also includes upper vias electrically connecting each of the upper conductive patterns to each of the middle conductive patterns, respectively, the upper vias being disposed in the upper insulation substrate, and lower vias electrically connecting each of the middle conductive patterns to each of the lower conductive patterns, respectively, the lower vias disposed in the lower insulation substrate.Type: GrantFiled: December 30, 2015Date of Patent: October 18, 2016Assignee: Seoul Semiconductor Co., Ltd.Inventors: Jung Hwa Jung, Hee Tak Oh, Do Hyung Kim, You Jin Kwon, Oh Sug Kim
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Publication number: 20160118563Abstract: A light-emitting diode package includes a package body and a light-emitting diode chip disposed on the package body. The package body includes upper conductive patterns disposed on an upper insulation substrate, a lower insulation substrate disposed on lower conductive patterns, and middle conductive patterns disposed between the upper insulation substrate and the lower insulation substrate. The package body also includes upper vias electrically connecting each of the upper conductive patterns to each of the middle conductive patterns, respectively, the upper vias being disposed in the upper insulation substrate, and lower vias electrically connecting each of the middle conductive patterns to each of the lower conductive patterns, respectively, the lower vias disposed in the lower insulation substrate.Type: ApplicationFiled: December 30, 2015Publication date: April 28, 2016Inventors: Jung Hwa JUNG, Hee Tak Oh, Do Hyung KIM, You Jin KWON, Oh Sug KIM
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Patent number: 9257624Abstract: A light emitting diode package includes a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes.Type: GrantFiled: April 3, 2015Date of Patent: February 9, 2016Assignee: Seoul Semiconductor Co., Ltd.Inventors: Jung Hwa Jung, Hee Tak Oh, Do Hyung Kim, You Jin Kwon, Oh Sug Kim
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Publication number: 20150214453Abstract: A light emitting diode package includes a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes.Type: ApplicationFiled: April 3, 2015Publication date: July 30, 2015Inventors: Jung Hwa JUNG, Hee Tak OH, Do Hyung KIM, You Jin KWON, Oh Sug KIM
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Publication number: 20150154917Abstract: A display device includes a power rectifying unit for rectifying alternating power, a power factor correction unit correcting the power factor of the alternating power and outputting a power factor corrected voltage containing a direct current voltage component having at least a predetermined size, a display module driven by the power factor corrected voltage, a backlight unit, and a driving unit supplying the main driving voltage to a backlight unit, receiving the power factor corrected voltage when the size of the rectified voltage is smaller than a preset threshold value to generate a supplementary driving voltage.Type: ApplicationFiled: December 21, 2012Publication date: June 4, 2015Applicant: Seoul Semiconductor Co., Ltd.Inventors: Hye Man Jung, Oh Sug Kim, Hyun Gu Kang, II Kyung Suh, Young Eun Yang
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Patent number: 9048391Abstract: A light emitting diode package includes a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes.Type: GrantFiled: June 30, 2014Date of Patent: June 2, 2015Assignee: Seoul Semiconductor Co., Ltd.Inventors: Jung Hwa Jung, Hee Tak Oh, Do Hyung Kim, You Jin Kwon, Oh Sug Kim
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Patent number: 8994061Abstract: A light emitting diode package includes a first lead frame comprising a first hole cup, a second lead frame comprising a second hole cup and disposed to face the first lead frame with a gap disposed between the first lead frame and the second lead frame, a first light emitting diode chip disposed on the first hole cup, and a second light emitting diode chip disposed on the second hole cup, the first lead frame comprising a first enlarged region formed between the gap and the first hole cup, and the second lead frame comprising a second enlarged region formed between the gap and the second hole cup.Type: GrantFiled: March 2, 2012Date of Patent: March 31, 2015Assignee: Seoul Semiconductor Co., Ltd.Inventors: Do Hyoung Kang, Oh Sug Kim
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Publication number: 20140312380Abstract: A light emitting diode package includes a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes.Type: ApplicationFiled: June 30, 2014Publication date: October 23, 2014Inventors: Jung Hwa Jung, Hee Tak Oh, Do Hyung Kim, You Jin Kwon, Oh Sug Kim
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Patent number: 8796706Abstract: Disclosed herein is a light emitting diode package including a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes.Type: GrantFiled: June 30, 2010Date of Patent: August 5, 2014Assignee: Seoul Semiconductor Co., Ltd.Inventors: Jung Hwa Jung, Hee Tak Oh, Do Hyung Kim, You Jin Kwon, Oh Sug Kim
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Publication number: 20120223343Abstract: A light emitting diode package includes a first lead frame comprising a first hole cup, a second lead frame comprising a second hole cup and disposed to face the first lead frame with a gap disposed between the first lead frame and the second lead frame, a first light emitting diode chip disposed on the first hole cup, and a second light emitting diode chip disposed on the second hole cup, the first lead frame comprising a first enlarged region formed between the gap and the first hole cup, and the second lead frame comprising a second enlarged region formed between the gap and the second hole cup.Type: ApplicationFiled: March 2, 2012Publication date: September 6, 2012Applicant: Seoul Semiconductor Co., Ltd.Inventors: Do Hyoung KANG, Oh Sug KIM
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Publication number: 20120056217Abstract: Disclosed herein is a light emitting diode package including a package body having a cavity, a light emitting diode chip having a plurality of light emitting cells connected in series to one another, a phosphor converting a frequency of light emitted from the light emitting diode chip, and a pair of lead electrodes. The light emitting cells are connected in series between the pair of lead electrodes.Type: ApplicationFiled: June 30, 2010Publication date: March 8, 2012Applicant: Seoul Semiconductor Co., Ltd.Inventors: Jung Hwa Jung, HeeTak Oh, Do Hyung Kim, You Jin Kwon, Oh Sug Kim
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Patent number: 8129231Abstract: A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that several semiconductor packages can be manufactured at once. A molding compound flow controller is optimally associated with the substrate or semiconductor package at one or more various locations. Flow controllers can control or direct the flow of the molding compound during the encapsulation process. Flow controllers can be sized, shaped, and positioned in order to smooth out the flow of the molding compound, such that the speed of the flow is substantially equivalent over areas of the substrate containing dies and over areas of the substrate without dies. In this manner, defects such as voids in the encapsulation, wire sweeping, and wire shorts can be substantially avoided during encapsulation.Type: GrantFiled: September 21, 2009Date of Patent: March 6, 2012Assignee: Stats Chippac, Inc.Inventors: Seng Guan Chow, Oh Sug Kim, Byung Tai Do
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Publication number: 20100009468Abstract: A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that several semiconductor packages can be manufactured at once. A molding compound flow controller is optimally associated with the substrate or semiconductor package at one or more various locations. Flow controllers can control or direct the flow of the molding compound during the encapsulation process. Flow controllers can be sized, shaped, and positioned in order to smooth out the flow of the molding compound, such that the speed of the flow is substantially equivalent over areas of the substrate containing dies and over areas of the substrate without dies. In this manner, defects such as voids in the encapsulation, wire sweeping, and wire shorts can be substantially avoided during encapsulation.Type: ApplicationFiled: September 21, 2009Publication date: January 14, 2010Inventors: Seng Guan Chow, Oh Sug Kim, Byung Tai Do
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Patent number: 7612444Abstract: A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that several semiconductor packages can be manufactured at once. A molding compound flow controller is optimally associated with the substrate or semiconductor package at one or more various locations. Flow controllers can control or direct the flow of the molding compound during the encapsulation process. Flow controllers can be sized, shaped, and positioned in order to smooth out the flow of the molding compound, such that the speed of the flow is substantially equivalent over areas of the substrate containing dies and over areas of the substrate without dies. In this manner, defects such as voids in the encapsulation, wire sweeping, and wire shorts can be substantially avoided during encapsulation.Type: GrantFiled: January 5, 2007Date of Patent: November 3, 2009Assignee: Stats Chippac, Inc.Inventors: Seng Guan Chow, Oh Sug Kim, Byung Tai Do
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Publication number: 20080164618Abstract: A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that several semiconductor packages can be manufactured at once. A molding compound flow controller is optimally associated with the substrate or semiconductor package at one or more various locations. Flow controllers can control or direct the flow of the molding compound during the encapsulation process. Flow controllers can be sized, shaped, and positioned in order to smooth out the flow of the molding compound, such that the speed of the flow is substantially equivalent over areas of the substrate containing dies and over areas of the substrate without dies. In this manner, defects such as voids in the encapsulation, wire sweeping, and wire shorts can be substantially avoided during encapsulation.Type: ApplicationFiled: January 5, 2007Publication date: July 10, 2008Inventors: Seng Guan Chow, Oh Sug Kim, Byung Tai Do