Patents by Inventor Ohad SHAUBI
Ohad SHAUBI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11755984Abstract: Presented herein are systems, methods and apparatuses for increasing reliability of face recognition in analysis of images captured by drone mounted imaging sensors, comprising: recognizing a target person in one or more iterations, each iteration comprising: identifying one or more positioning properties of the target person based on analysis of image(s) captured by imaging sensor(s) mounted on a drone operated to approach the target person, instructing the drone to adjust its position to an optimal facial image capturing position selected based on the positioning property(s), receiving facial image(s) of the target person captured by the imaging sensor(s), receiving a face classification associated with a probability score from machine learning model(s) trained to recognize the target person, and initiating another iteration in case the probability score does not exceed a certain threshold. Finally, the face classification may be outputted for use by one or more face recognition based systems.Type: GrantFiled: July 20, 2020Date of Patent: September 12, 2023Assignee: Anyvision Interactive Technologies Ltd.Inventors: Ishay Sivan, Ailon Etshtein, Alexander Zilberman, Neil Martin Robertson, Sankha Subhra Mukherjee, Rolf Hugh Baxter, Ohad Shaubi, Idan Barak
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Patent number: 11568531Abstract: There is provided a method of examination of a semiconductor specimen and a system thereof. The method comprises: using a trained Deep Neural Network (DNN) to process a fabrication process (FP) sample, wherein the FP sample comprises first FP image(s) received from first examination modality(s) and second FP image(s) received from second examination modality(s) which differs from the first examination modality(s), and wherein the trained DNN processes the first FP image(s) separately from the second FP image(s); and further processing by the trained DNN the results of such separate processing to obtain examination-related data specific for the given application and characterizing at least one of the processed FP images. When the FP sample further comprises numeric data associated with the FP image(s), the method further comprises processing by the trained DNN at least part of the numeric data separately from processing the first and the second FP images.Type: GrantFiled: June 3, 2020Date of Patent: January 31, 2023Assignee: Applied Materials Israel Ltd.Inventors: Ohad Shaubi, Denis Suhanov, Assaf Asbag, Boaz Cohen
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Publication number: 20220222806Abstract: There is provided a method of automated defects' classification, and a system thereof. The method comprises obtaining data informative of a set of defects' physical attributes usable to distinguish between defects of different classes among the plurality of classes; training a first machine learning model to generate, for the given defect, a multi-label output vector informative of values of the physical attributes, thereby generating for the given defect a multi-label descriptor; and using the trained first machine learning model to generate multi-label descriptors of the defects in the specimen. The method can further comprise obtaining data informative of multi-label data sets, each data set being uniquely indicative of a respective class of the plurality of classes and comprising a unique set of values of the physical attributes; and classifying defects in the specimen by matching respectively generated multi-label descriptors of the defects to the multi-label data sets.Type: ApplicationFiled: March 24, 2020Publication date: July 14, 2022Inventors: Ohad SHAUBI, Boaz COHEN, Kirill SAVCHENKO, Ore SHTALRID
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Patent number: 11199506Abstract: There is provided a system and method of generating a training set usable for examination of a semiconductor specimen. The method comprises: obtaining a simulation model capable of simulating effect of a physical process on fabrication process (FP) images depending on the values of parameters of the physical process; applying the simulation model to an image to be augmented for the training set and thereby generating one or more augmented images corresponding to one or more different values of the parameters of the physical process; and including the generated one or more augmented images into the training set. The training set can be usable for examination of the specimen using a trained Deep Neural Network, automated defect review, automated defect classification, automated navigation during the examination, automated segmentation of FP images, automated metrology based on FP images and other examination processes that include machine learning.Type: GrantFiled: February 20, 2019Date of Patent: December 14, 2021Assignee: Applied Materials Israel Ltd.Inventors: Ohad Shaubi, Assaf Asbag, Boaz Cohen
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Patent number: 11037286Abstract: There are provided a classifier and a method of classifying defects in a semiconductor specimen. The classifier enables assigning each class to a classification group among three or more classification groups with different priorities. Classifier further enables setting purity, accuracy and/or extraction requirements separately for each class, and optimizing the classification results in accordance with per-class requirements. During training, the classifier is configured to generate a classification rule enabling the highest possible contribution of automated classification while meeting per-class quality requirements defined for each class.Type: GrantFiled: September 28, 2017Date of Patent: June 15, 2021Assignee: Applied Materials Israel Ltd.Inventors: Assaf Asbag, Ohad Shaubi, Kirill Savchenko, Shiran Gan-Or, Boaz Cohen, Zeev Zohar
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Publication number: 20210034843Abstract: Presented herein are systems, methods and apparatuses for increasing reliability of face recognition in analysis of images captured by drone mounted imaging sensors, comprising: recognizing a target person in one or more iterations, each iteration comprising: identifying one or more positioning properties of the target person based on analysis of image(s) captured by imaging sensor(s) mounted on a drone operated to approach the target person, instructing the drone to adjust its position to an optimal facial image capturing position selected based on the positioning property(s), receiving facial image(s) of the target person captured by the imaging sensor(s), receiving a face classification associated with a probability score from machine learning model(s) trained to recognize the target person, and initiating another iteration in case the probability score does not exceed a certain threshold. Finally, the face classification may be outputted for use by one or more face recognition based systems.Type: ApplicationFiled: July 20, 2020Publication date: February 4, 2021Applicant: Anyvision Interactive Technologies Ltd.Inventors: Ishay SIVAN, Ailon ETSHTEIN, Alexander ZILBERMAN, Neil Martin ROBERTSON, Sankha Subhra MUKHERJEE, Rolf Hugh BAXTER, Ohad SHAUBI, Idan BARAK
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Patent number: 10832092Abstract: There is provided a method of examination of a semiconductor specimen. The method comprises: upon obtaining by a computer a Deep Neural Network (DNN) trained for a given examination-related application within a semiconductor fabrication process, processing together one or more fabrication process (FP) images using the obtained trained DNN, wherein the DNN is trained using a training set comprising synthetic images specific for the given application; and obtaining, by the computer, examination-related data specific for the given application, and characterizing at least one of the processed one or more FP images. Generating the training set can comprise: training an auxiliary DNN to generate a latent space, generating a synthetic image by applying the trained auxiliary DNN to a point selected in the generated latent space, and adding the generated synthetic image to the training set.Type: GrantFiled: February 7, 2019Date of Patent: November 10, 2020Assignee: Applied Materials Israel Ltd.Inventors: Ohad Shaubi, Assaf Asbag, Boaz Cohen
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Patent number: 10803575Abstract: There is provided a system that includes a review tool configured to review at least part of potential defects of an examined object, and assign each of the at least part of the potential defects with a multiplicity of attribute values. The system also includes a computer-based classifier configured to classify, based on the attribute values as assigned, the at least part of potential defects into a set of classes, the set comprising at least a first major class, a second major class and a first minor class, the classifier trained based on a training set comprising a multiplicity of training defects with assigned attribute values, the training defects classified into the set of classes.Type: GrantFiled: July 22, 2019Date of Patent: October 13, 2020Assignee: APPLIED MATERIALS ISRAEL LTD.Inventors: Ohad Shaubi, Assaf Asbag, Idan Kaizerman
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Publication number: 20200294224Abstract: There is provided a method of examination of a semiconductor specimen and a system thereof. The method comprises: using a trained Deep Neural Network (DNN) to process a fabrication process (FP) sample, wherein the FP sample comprises first FP image(s) received from first examination modality(s) and second FP image(s) received from second examination modality(s) which differs from the first examination modality(s), and wherein the trained DNN processes the first FP image(s) separately from the second FP image(s); and further processing by the trained DNN the results of such separate processing to obtain examination-related data specific for the given application and characterizing at least one of the processed FP images. When the FP sample further comprises numeric data associated with the FP image(s), the method further comprises processing by the trained DNN at least part of the numeric data separately from processing the first and the second FP images.Type: ApplicationFiled: June 3, 2020Publication date: September 17, 2020Inventors: Ohad SHAUBI, Denis SUHANOV, Assaf ASBAG, Boaz COHEN
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Publication number: 20200226420Abstract: There is provided a method of examination of a semiconductor specimen. The method comprises: upon obtaining by a computer a Deep Neural Network (DNN) trained for a given examination-related application within a semiconductor fabrication process, processing together one or more fabrication process (FP) images using the obtained trained DNN, wherein the DNN is trained using a training set comprising synthetic images specific for the given application; and obtaining, by the computer, examination-related data specific for the given application, and characterizing at least one of the processed one or more FP images. Generating the training set can comprise: training an auxiliary DNN to generate a latent space, generating a synthetic image by applying the trained auxiliary DNN to a point selected in the generated latent space, and adding the generated synthetic image to the training set.Type: ApplicationFiled: February 7, 2019Publication date: July 16, 2020Inventors: Ohad SHAUBI, Assaf ASBAG, Boaz COHEN
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Publication number: 20190347785Abstract: There is provided a system that includes a review tool configured to review at least part of potential defects of an examined object, and assign each of the at least part of the potential defects with a multiplicity of attribute values. The system also includes a computer-based classifier configured to classify, based on the attribute values as assigned, the at least part of potential defects into a set of classes, the set comprising at least a first major class, a second major class and a first minor class, the classifier trained based on a training set comprising a multiplicity of training defects with assigned attribute values, the training defects classified into the set of classes.Type: ApplicationFiled: July 22, 2019Publication date: November 14, 2019Inventors: Ohad SHAUBI, Assaf ASBAG, Idan KAIZERMAN
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Publication number: 20190257767Abstract: There is provided a system and method of generating a training set usable for examination of a semiconductor specimen. The method comprises: obtaining a simulation model capable of simulating effect of a physical process on fabrication process (FP) images depending on the values of parameters of the physical process; applying the simulation model to an image to be augmented for the training set and thereby generating one or more augmented images corresponding to one or more different values of the parameters of the physical process; and including the generated one or more augmented images into the training set. The training set can be usable for examination of the specimen using a trained Deep Neural Network, automated defect review, automated defect classification, automated navigation during the examination, automated segmentation of FP images, automated metrology based on FP images and other examination processes that include machine learning.Type: ApplicationFiled: February 20, 2019Publication date: August 22, 2019Inventors: Ohad SHAUBI, Assaf ASBAG, Boaz COHEN
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Patent number: 10360669Abstract: There are provided a system, computer software product and method of generating a training set for a classifier using a processor. The method comprises: receiving a training set comprising training defects each having assigned attribute values, the training defects externally classified into classes comprising first and second major classes and a minor class; training a classifier upon the training set; receiving results of automatic classification of the training defects; automatically identifying a first defect that was externally classified into the first major class and automatically classified into the second major class; automatically identifying by the processor a second defect from the multiplicity of training defects that was externally classified into the minor class and automatically classified to the first or second major classes; and correcting the training set to include the first defect into the second major class, or to include the second defect into the first or the second major class.Type: GrantFiled: August 24, 2017Date of Patent: July 23, 2019Assignee: APPLIED MATERIALS ISRAEL LTD.Inventors: Ohad Shaubi, Assaf Asbag, Idan Kaizerman
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Publication number: 20190096053Abstract: There are provided a classifier and a method of classifying defects in a semiconductor specimen. The classifier enables assigning each class to a classification group among three or more classification groups with different priorities. Classifier further enables setting purity, accuracy and/or extraction requirements separately for each class, and optimizing the classification results in accordance with per-class requirements. During training, the classifier is configured to generate a classification rule enabling the highest possible contribution of automated classification while meeting per-class quality requirements defined for each class.Type: ApplicationFiled: September 28, 2017Publication date: March 28, 2019Inventors: Assaf ASBAG, Ohad SHAUBI, Kirill SAVCHENKO, Shiran GAN-OR, Boaz COHEN, Zeev ZOHAR
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Publication number: 20190066290Abstract: There are provided a system, computer software product and method of generating a training set for a classifier using a processor. The method comprises: receiving a training set comprising training defects each having assigned attribute values, the training defects externally classified into classes comprising first and second major classes and a minor class; training a classifier upon the training set; receiving results of automatic classification of the training defects; automatically identifying a first defect that was externally classified into the first major class and automatically classified into the second major class; automatically identifying by the processor a second defect from the multiplicity of training defects that was externally classified into the minor class and automatically classified to the first or second major classes; and correcting the training set to include the first defect into the second major class, or to include the second defect into the first or the second major class.Type: ApplicationFiled: August 24, 2017Publication date: February 28, 2019Inventors: Ohad SHAUBI, Assaf ASBAG, Idan KAIZERMAN