Abstract: Disclosed herein is an optical modulator module package using a flip-chip mounting technology, in which an optical modulator device is hermetically mounted using the flip-chip mounting technology. The optical modulator device is protected from an external environment, it is easy to transmit an electrical signal to the exterior, and optical characteristics of the optical modulator device are desirably maintained.

Abstract: A micro-electro-mechanical system (MEMS) package having a metal sealing member is disclosed. The MEMS package is formed by forming a metal layer on a substrate by patterning so that the metal layer surrounds an MEMS element provided on the substrate; joining a lid to the metal layer; providing a side sealing member on a side surface of the substrate; and covering the lid and the substrate with a metal sealing member, thus hermetically sealing the MEMS element from the external environment.

Abstract: The present invention relates, in general, to a light modulator having a variable blaze diffraction grating and, more particularly, to a light modulator having a variable blaze diffraction grating, in which a diffraction member rotates due to piezoelectric force so as to incline a reflective surface.

Abstract: The present invention relates to a MEMS package, and in particular, to the structure of a MEMS package. One aspect of the invention provides an optical modulator module package comprising a substrate, an optical modulator positioned on the substrate which modulates an optical signal and transmits the optical signal through the substrate, a driver IC (driver integrated circuit) mounted adjacent to the optical modulator which operates the optical modulator, circuit wiring formed on the substrate and configured which transfers signals for operating the optical modulator, and a printed circuit board positioned facing the substrate on the optical modulator and the driver IC for signal connection with an external circuit. With a MEMS module package according to an aspect of the invention, the overall size can be reduced by providing a different form of layer composition.

Abstract: Disclosed herein is a light modulator module package, which is advantageous because a size of the module package is minimized and heat is efficiently dispersed while the optical properties of a light modulator device are maintained.

Abstract: Disclosed herein is a package structure for an optical modulator, which is configured such that an optical modulating device and electronic control circuitry are incorporated into a module, thus allowing the manufacture of a compact module while maintaining the optical properties of the optical modulating device.

Abstract: A micro-electro-mechanical system (MEMS) package with a spacer for sealing and a method of manufacturing the package are disclosed. The MEMS package and method of the present invention hermetically and reliably seals MEMS elements from an external environment, including temperature, humidity, impact and vibration, by a sealing unit which has a spacer integrated with a lid glass to secure an MEMS moving space where the MEMS elements are free to move vertically. The present invention simplifies the process of manufacturing the MEMS package and prevents solder from flowing into the package. The MEMS package and method according to the present invention also allow a reworking process, such as for adding solder, to be executed when the sealing is not complete due to inaccurate positioning of the solder and/or application of a deficient amount of solder to a junction between the base substrate and the lid glass.