Patents by Inventor Ohnishi Katsuga

Ohnishi Katsuga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4845313
    Abstract: A metallic core printed circuit board having a number of lead terminals such as IC or LSI lead terminals provided on at least one edge of an electrically conductive substrate which forms a core by etching or other process. The respective terminals are electrically insulated from and secured to the core by an insulating binder, and then either conductor circuit patterns are directly formed on or a printed board wherein a printed circuit has been completed is bonded to the layer of the insulating binder. The metallic core printed circuit board makes it possible to increase a packaging density of required components, to allow easy connection to other circuit boards such as a mother board and the like, and to reduce a volume of the circuit.
    Type: Grant
    Filed: March 19, 1987
    Date of Patent: July 4, 1989
    Assignee: Tokyo Communication Equipment Co., Ltd.
    Inventors: Satoru Endoh, Ohnishi Katsuga