Patents by Inventor Ohse Takeshi

Ohse Takeshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUBSTRATE PROCESSING METHOD
    Publication number: 20120247677
    Abstract: A substrate processing apparatus capable of improving a processing controllability in an etching process is provided. The substrate processing apparatus (10) includes a depressurized processing room (11); a susceptor (12) that is provided in the processing room (11) and configured to mount a wafer (W) thereon; a HF high frequency power supply (18) configured to apply a high frequency voltage for plasma generation to the susceptor (12); a LF high frequency power supply (20) configured to apply a high frequency voltage for a bias voltage generation to the susceptor (12); and a DC voltage applying unit (23) configured to apply a DC voltage of a rectangle-shaped wave to the susceptor (12).
    Type: Application
    Filed: March 30, 2012
    Publication date: October 4, 2012
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Shinji Himori, Norikazu Yamada, Ohse Takeshi