Patents by Inventor Oi Fong Chin

Oi Fong Chin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for controlled fracture substrate singulation
    Patent number: 7172951
    Abstract: An apparatus and a system for separating dice from a substrate are described herein.
    Type: Grant
    Filed: November 30, 2005
    Date of Patent: February 6, 2007
    Assignee: Intel Corporation
    Inventors: Oi Fong Chin, Yew Wee Cheong, Weng Khoon Mong
  • Controlled fracture substrate singulation
    Patent number: 7005317
    Abstract: Methods and apparatus for separating dice from a substrate are described herein.
    Type: Grant
    Filed: October 27, 2003
    Date of Patent: February 28, 2006
    Assignee: Intel Corporation
    Inventors: Oi Fong Chin, Yew Wee Cheong, Weng Khoon Mong