Patents by Inventor Oing Ma

Oing Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Mems moving platform with lateral zipping actuators
    Publication number: 20080309191
    Abstract: A MEMS platform with four actuators and four corresponding actuation electrodes. Movement of the platform in the x-y lateral plane is controlled by voltages applied to the four actuation electrodes. Other embodiments are described and claimed.
    Type: Application
    Filed: June 14, 2007
    Publication date: December 18, 2008
    Inventors: Tsung-Kuan Allen Chou, Oing Ma
  • Tunable resonator with MEMS element
    Patent number: 7339446
    Abstract: According to an embodiment of the present invention, a microelectromechanical system (MEMS) element tunes a resonator to a frequency.
    Type: Grant
    Filed: June 16, 2005
    Date of Patent: March 4, 2008
    Assignee: Intel Corporation
    Inventors: Jun Su, Dong S. Shim, Oing Ma, Valluri R. Rao
  • Tunable resonator with MEMS element
    Publication number: 20060290445
    Abstract: According to an embodiment of the present invention, a microelectromechanical system (MEMS) element tunes a resonator to a frequency.
    Type: Application
    Filed: June 16, 2005
    Publication date: December 28, 2006
    Inventors: Jun Su, Dong Shim, Oing Ma, Valluri Rao
  • Structure to achieve high-Q and low insertion loss film bulk acoustic resonators
    Patent number: 7116034
    Abstract: A film bulk acoustic resonator is formed on a substrate. The film bulk acoustic resonator includes a layer of piezoelectric material having a first surface proximate the substrate, and a second surface distal from the substrate. The first conductive layer deposited on the first surface of the piezoelectric material includes a first portion having a surface on a different plane than a surface associated with a second portion.
    Type: Grant
    Filed: February 23, 2005
    Date of Patent: October 3, 2006
    Assignee: Intel Corporation
    Inventors: Li-Peng Wang, Oing Ma, Valluri Rao
  • Structure to achieve high-Q and low insertion loss film bulk acoustic resonators
    Publication number: 20050140246
    Abstract: A film bulk acoustic resonator is formed on a substrate. The film bulk acoustic resonator includes a layer of piezoelectric material having a first surface proximate the substrate, and a second surface distal from the substrate. The first conductive layer deposited on the first surface of the piezoelectric material includes a first portion having a surface on a different plane than a surface associated with a second portion.
    Type: Application
    Filed: February 23, 2005
    Publication date: June 30, 2005
    Inventors: Li-Peng Wang, Oing Ma, Valluri Rao
  • Method of fabricating an integrated circuit that seals a MEMS device within a cavity
    Publication number: 20030087469
    Abstract: A method of fabricating an integrated circuit that includes a microelectromechanical (MEMS) device. The method includes forming a MEMS device on a substrate and forming an integrated circuit. The method further includes coupling the substrate to the integrated circuit to form a sealed cavity that includes the MEMS device. The substrate and the integrated circuit are coupled together in a controlled environment to establish a controlled environment within the cavity where the MEMS device is located.
    Type: Application
    Filed: November 2, 2001
    Publication date: May 8, 2003
    Applicant: Intel Corporation
    Inventor: Oing Ma