Patents by Inventor Okgyeong PARK

Okgyeong PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packages including molding layers
    Patent number: 8922024
    Abstract: Semiconductor packages including molding layer and methods of fabricating the same are provided. The method may include forming a bare package including a semiconductor chip on a package substrate and forming a molding layer surrounding the semiconductor chip on the package substrate while contacting an upper surface of the molding layer with a lower surface of a release film. The lower surface of the release film and the upper surface of the molding layer comprising uneven surfaces and the molding layer may expose an upper surface of the semiconductor chip.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: December 30, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Minok Na, Okgyeong Park, Ji-Hyun Park
  • SEMICONDUCTOR PACKAGES INCLUDING MOLDING LAYERS
    Publication number: 20130292848
    Abstract: Semiconductor packages including molding layer and methods of fabricating the same are provided. The method may include forming a bare package including a semiconductor chip on a package substrate and forming a molding layer surrounding the semiconductor chip on the package substrate while contacting an upper surface of the molding layer with a lower surface of a release film. The lower surface of the release film and the upper surface of the molding layer comprising uneven surfaces and the molding layer may expose an upper surface of the semiconductor chip.
    Type: Application
    Filed: March 14, 2013
    Publication date: November 7, 2013
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Minok NA, Okgyeong PARK, Ji-Hyun PARK