Patents by Inventor Ok-Seon YOON

Ok-Seon YOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing insulation film and printed circuit board
    Patent number: 9907182
    Abstract: A method of manufacturing an insulation film includes: coating a resin composite on a lower protective film, the resin composite including an inorganic filler dispersed therein; forming an insulating layer by drying the resin composite such that the inorganic filler is precipitated in the coated resin composite; and laminating an upper protective film on the insulating layer.
    Type: Grant
    Filed: March 9, 2016
    Date of Patent: February 27, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ho-Hyung Ham, Hwa-Young Lee, Jae-Kul Lee, Ok-Seon Yoon
  • METHOD OF MANUFACTURING INSULATION FILM AND PRINTED CIRCUIT BOARD
    Publication number: 20170086303
    Abstract: A method of manufacturing an insulation film includes: coating a resin composite on a lower protective film, the resin composite including an inorganic filler dispersed therein; forming an insulating layer by drying the resin composite such that the inorganic filler is precipitated in the coated resin composite; and laminating an upper protective film on the insulating layer.
    Type: Application
    Filed: March 9, 2016
    Publication date: March 23, 2017
    Applicant: Samsung Electro-Mechanic Co., Ltd.
    Inventors: Ho-Hyung HAM, Hwa-Young LEE, Jae-Kul LEE, Ok-Seon YOON