Patents by Inventor Ok Shil Park

Ok Shil Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11447886
    Abstract: The present disclosure relates to an electroplated bead wire having excellent oxidation resistance, of which oxidation resistance and aging adhesive strength with tire rubber are improved by forming a copper- and cobalt-plated layer by electroplating. The electroplated bead wire includes the plated layer formed through electroplating, wherein the plated layer contains 40 to 99 wt % of copper and 1 to 40 wt % of cobalt.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: September 20, 2022
    Assignee: Hongduk Industrial Co., Ltd.
    Inventors: Pyeong Yeol Park, Ok Shil Park
  • Publication number: 20210146417
    Abstract: Provided are a high-strength bead wire and a method of manufacturing the same. The method includes preparing a wire rod containing 0.86% to 1.02% by weight of carbon, applying 5 g/m2 to 10 g/m2 of phosphate coating onto the surface of the wire rod, and drawing the wire rod onto which the phosphate coating is applied. In the drawing, the wire rod is drawn by a drawing apparatus including a drawing die capable of drawing the wire rod and a pressure die installed in front of the drawing die and capable of applying pressure to the wire rod. The diameter of the pressure die is 1.05 times to 1.20 times the diameter of the drawing die. The high-strength bead wire includes a wire rod containing 0.86% to 1.02% by weight of carbon and 5 g/m2 to 10 g/m2 of the phosphate coating applied onto the surface of the wire rod and is manufactured by the above-described method.
    Type: Application
    Filed: July 6, 2018
    Publication date: May 20, 2021
    Applicant: Hongduk Industrial Co., Ltd.
    Inventors: Ok Shil Park, Dong Jin PARK
  • Publication number: 20210002782
    Abstract: The present disclosure relates to an electroplated bead wire having excellent oxidation resistance, of which oxidation resistance and aging adhesive strength with tire rubber are improved by forming a copper- and cobalt-plated layer by electroplating. The electroplated bead wire includes the plated layer formed through electroplating, wherein the plated layer contains 40 to 99 wt % of copper and 1 to 40 wt % of cobalt.
    Type: Application
    Filed: February 25, 2019
    Publication date: January 7, 2021
    Applicant: Hongduk Industrial Co., Ltd.
    Inventors: Pyeong Yeol Park, Ok Shil Park