Abstract: A device for forming seam of elbow duct is provided, and the device for forming seam of elbow duct that molds a lockseam by bending a flange of one pair of adjacent unit members, of a plurality of unit members constituting the elbow duct, including a base that supports a lower portion of the one pair of unit members; an elevating part that moves the base up and down; an angle adjustment part that adjusts a supporting angle of the base; a fixing chuck that supports an inner circumferential surface of a connecting portion of the one pair of unit members; a rotating part that rotates the fixing chuck; and a forming part that bends the flange of the one pair of unit members in a state where the flange is in contact to each other, to form the seam.

Abstract: The present disclosure relates to an apparatus for forming flange of circular duct, and the apparatus for forming flange of circular duct according to the present disclosure includes a forming jig that is disposed to surround an outer circumference of a lower end portion of a duct, and that has a forming groove on a surface facing the duct; a support that supports a lower end of the duct below the forming jig; a height adjustor that adjusts height of the support; and a forming unit that hits an inner circumference of the lower end portion of the duct to form a flange having a shape corresponding to the forming groove of the forming jig on the lower end portion of the duct, wherein the forming groove includes a first forming surface formed on the surface facing the duct, and a second forming surface additionally extended from a distal end portion of the first forming surface, and the height adjustor is configured to adjust a relative position of the support with respect to the forming jig such that the flange

Abstract: The present disclosure relates to a duct cutting and forming apparatus for elbow duct manufacturing machine, the apparatus including a rotation housing that is provided with a seating groove in a first direction; an eccentric housing that is provided with a cutting roller and a forming roller at both ends, and that is slidably seated inside the seating groove; a rotation drive for applying rotation driving force to the rotation housing; and an eccentric drive for applying driving force for reciprocating the eccentric housing, wherein the eccentric drive reciprocates the eccentric housing as it rotates in both directions within a range not exceeding 180 degrees.

Abstract: A printed circuit board includes an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; and a metal bump formed on the circuit pattern and the insulating layer

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

Abstract: A printed circuit board includes an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; and a metal bump formed on the circuit pattern and the insulating layer

Abstract: In accordance with various embodiments, there is provided a method of manufacturing a printed circuit board, the method including the steps of preparing a first carrier including a first pattern formed on one side thereof, preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof, pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates, attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other, and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

Abstract: A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.

Abstract: A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a metal carrier; forming a barrier layer on the metal carrier including the recess; forming an upper circuit layer on the barrier layer, the upper circuit layer including the metal bump charged in the recess and a circuit pattern; preparing an insulating layer, and transferring the upper circuit layer to the insulating layer; and removing the metal carrier and the barrier layer.

Abstract: A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a first carrier, forming a first barrier layer on the first carrier, and forming an upper circuit layer on the first barrier layer, the upper circuit layer including a metal bump charged in the recess and a circuit pattern; forming a second barrier layer on a second carrier, and forming a lower circuit layer on the second barrier layer; preparing an insulating layer, and transferring the upper and lower circuit layers to the insulating layer; removing the first and second carriers; and removing the first and second barrier layers.

Abstract: A printed circuit board having a metal bump, including: an upper circuit layer including a circuit pattern embedded in an upper part of an insulating layer, the circuit pattern being made of electroconductive metal; wherein the metal bump is integrally formed with the circuit pattern and protruding from the circuit pattern and above the insulating layer.

Abstract: A method of fabricating a printed circuit board, the method including: providing an insulating base body having a first surface on which a first circuit pattern is formed, and a second surface opposite to the first surface; pressing the first surface of the insulating base body onto at least one surface of an insulating layer such that the first circuit pattern is embedded in the insulating layer; forming a resist having a desired pattern on the second surface of the insulating base body; forming a trench by performing a plasma treatment on the second surface of the insulating base body on which the resist is formed; and forming a second circuit pattern by filling the trench with a conductive material. Accordingly, the conductive patterns can be formed using a simple process, thereby enhancing a process rate and productivity.

Abstract: Disclosed herein is a method of manufacturing a printed circuit board, comprising: preparing a first carrier including a first pattern formed on one side thereof; preparing a second carrier including a first solder resist layer and a second pattern sequentially formed on one side thereof; pressing the first carrier and the second carrier such that the first pattern is embedded in one side of an insulation layer and the second pattern is embedded in the other side of the insulation layer and then removing the first carrier and the second carrier to fabricate two substrates; attaching the two substrates to each other using an adhesion layer such that the first solder resist layers face each other; and forming a via for connecting the first pattern with the second pattern in the insulation layer, forming a second solder resist on the insulation layer provided with the first pattern, and then removing the adhesion layer.

Abstract: Provided are a printed circuit board (PCB), and a manufacturing method thereof. The PCB includes a stacked structure including second and third insulation layers with a first insulation layer interposed therebetween, and a conductive via having first to fourth conductive vias. A second-layer circuit pattern and a third-layer circuit pattern are buried in the first insulation layer, a first-layer circuit pattern is formed on the second insulation layer, and a fourth-layer circuit pattern is formed on the third insulation layer. A first conductive via connects the first-layer circuit pattern and the second-layer circuit pattern, a second conductive via connects the first-layer circuit pattern and the third-layer circuit pattern, a third conductive via connects the second-layer circuit pattern and the fourth-layer circuit pattern, and a fourth conductive via connects the third-layer circuit pattern and the fourth-layer circuit pattern.

Abstract: Disclosed is a printed circuit board, which includes a first circuit layer embedded in one surface an insulating layer and including a bump pad and a wire bonding pad, thus realizing a high-density wire bonding pad. A semiconductor device including the printed circuit board and a method of manufacturing the printed circuit board are also provided.

Abstract: Disclosed herein are a printed circuit board and a process of manufacturing the printed circuit board. The printed circuit board includes an insulating layer, and circuit layers disposed at both sides of the insulating layer, each of the circuit layers including a land part and a pattern part. The land parts formed on both sides of the insulating layer are coupled to each other using electrical resistance welding. There is no need for a separate interlayer connection structure such as vias or bumps and a process of forming the interlayer connection structure, thus simplifying the printed circuit board and the process.

Abstract: The invention relates to a printed circuit board having metal bumps which are of even heights and are directly connected to a circuit pattern without using additional bump pads thus allowing an arrangement thereof at fine pitches.

Abstract: Disclosed herein is footwear. The footwear includes a midsole, a shock absorbing means, and an outsole. The midsole has on an upper surface thereof an air passage. At least one insertion recess is provided in a lower surface of the midsole and communicates with the air passage. The shock absorbing means is made of an elastic material and movable up and down by flow of air present in the shock absorbing means. The upper end of the shock absorbing means is opened and secured to the insertion recess of the midsole, and the lower end of the shock absorbing means is closed and protrudes downwards. The outsole functions to secure the shock absorbing means to the midsole. The present invention provides footwear having a shock absorbing means having a simple structure and a superior shock absorbing function, thus having high durability.

Abstract: The present invention relates to a shoe having an outsole to form a bottom of the shoe, a mid-sole provided on the top of the outsole, and an insole provided on the top of the mid-sole, contacting the sole of a user's foot, comprising a cushion support part formed with a spring having a predetermined degree of elasticity, to relieve shocks applied to the user's foot; a receiving part formed by depressing one portion of the mid-sole, to receive the cushion support part; an air discharging passage communicating the receiving part with the outside of the outsole, through which partial air of the receiving part is discharged toward the outside of the outsole; and an air check valve provided in the air discharging passage, to prevent air discharged to the outside through the air discharging passage from flowing backward.

Abstract: In-line type electron gun in a color cathode ray tube including a pre-focusing lens part having at least two electrodes for focusing electron beams, a main lens part having two, or more than two electrodes for focusing the electron beams onto a screen, and at least one electrostatic field controlling electrode in the electrodes of the main lens part having a center electron beam pass through hole and two outer electron beam pass through holes, wherein each of the outer electron beam pass through holes has a form a circular hole and a rectangular hole are combined therein, the rectangular hole having a height ‘V2’ greater than a vertical diameter ‘V1’ of the center beam pass through hole of the electrostatic field controlling electrode, thereby permitting an excellent focusing and improving assembly work.