Patents by Inventor Okazaki Tadao

Okazaki Tadao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6178833
    Abstract: Disclosed is an electronic parts loading device comprising a head unit on which a operating means, such as a loading mechanism for loading electronic parts on a printed circuit board or an adhesive spread mechanism for spreading adhesive on a place of the printed circuit board where the electronic parts are to be mounted, is mounted; driving means for moving the operating means toward or away from the printed circuit board; measuring means for measuring a distance from the head unit to a loading place of the printed circuit board, the measuring means being mounted on the head unit; and control means for optimally controlling the movement of the operating means in response to data measured by the measuring means whenever the operating means performs a working.
    Type: Grant
    Filed: February 24, 1998
    Date of Patent: January 30, 2001
    Assignee: Samsung Aerospace Industries, Ltd.
    Inventors: Fujioka Teruhiko, Okazaki Tadao, Maebara Yoshikazu
  • Patent number: 5829689
    Abstract: An apparatus for spreading a fluid substance, includes a container containing the fluid substance and a supporting unit. A lower holding unit, connected to the supporting unit, holds a lower end of the container. An upper holding unit, connected to the supporting unit, holds an upper end of the container. A driving unit, connected to the supporting unit, drives the container up or down. A rotating unit, connected to the supporting unit, rotates the container around a vertical axis.
    Type: Grant
    Filed: January 28, 1997
    Date of Patent: November 3, 1998
    Assignee: Samsung Aerospace Industries, Ltd.
    Inventors: Okazaki Tadao, Maebara Yoshikazu
  • Patent number: 5817957
    Abstract: An electronic parts loading device includes a head unit on which an operating element, such as a loading mechanism for loading electronic parts on a printed circuit board or an adhesive spread mechanism for spreading adhesive on the printed circuit board where the electronic parts are to be mounted, is mounted. The electronic parts loading device also includes a driving element for moving the operating element toward or away from the printed circuit board, a measuring element, mounted on the head unit, for measuring a distance from the head unit to a loading location on the printed circuit board, and a control element for optimally controlling the movement of the operating element in response to data measured by the measuring element whenever the operating element performs a loading or spreading application.
    Type: Grant
    Filed: January 28, 1997
    Date of Patent: October 6, 1998
    Assignee: Samsung Aerospace Industries, Ltd.
    Inventors: Fujioka Teruhiko, Okazaki Tadao, Maebara Yoshikazu