Patents by Inventor Oki Nagashima

Oki Nagashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Position indicator and manufacturing method thereof
    Patent number: 9665190
    Abstract: A position indicator includes: a chassis; a substrate disposed inside the chassis; a coil; capacitors disposed on the substrate; interconnects disposed on the substrate such that each at least partially connects a respective one of the capacitors to the coil in parallel; and pairs of land patterns. Each pair of land patterns includes a first land pattern and a second land pattern. Each of the interconnects has a first end connected to a first end of the coil and a second end connected to a second end of the coil, and is connected to one of the capacitors. The pairs of land patterns are disposed such that each of the interconnects is at least partially interposed between the first land pattern and the second land pattern of one of the pairs of land patterns.
    Type: Grant
    Filed: July 27, 2015
    Date of Patent: May 30, 2017
    Assignee: Wacom Co., Ltd.
    Inventors: Hiromichi Kanzaki, Gunji Ishihara, Taketoshi Ito, Takashi Yamaguchi, Oki Nagashima
  • POSITION INDICATOR AND MANUFACTURING METHOD THEREOF
    Publication number: 20160034049
    Abstract: A position indicator includes: a chassis; a substrate disposed inside the chassis; a coil; capacitors disposed on the substrate; interconnects disposed on the substrate such that each at least partially connects a respective one of the capacitors to the coil in parallel; and pairs of land patterns. Each pair of land patterns includes a first land pattern and a second land pattern. Each of the interconnects has a first end connected to a first end of the coil and a second end connected to a second end of the coil, and is connected to one of the capacitors. The pairs of land patterns are disposed such that each of the interconnects is at least partially interposed between the first land pattern and the second land pattern of one of the pairs of land patterns.
    Type: Application
    Filed: July 27, 2015
    Publication date: February 4, 2016
    Inventors: Hiromichi Kanzaki, Gunji Ishihara, Taketoshi Ito, Takashi Yamaguchi, Oki Nagashima