Patents by Inventor Okito Umehara
Okito Umehara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11901234Abstract: There is provided a method of processing a wafer having devices formed in respective areas on a face side thereof that are demarcated by a plurality of crossing projected dicing lines on the face side. The method of processing a wafer includes a wafer unit forming step of forming a wafer unit having a wafer, a tape, and an annular frame, a dividing step of dividing the wafer along the projected dicing lines into a plurality of device chips, a pick-up step of picking up one at a time of the device chips from the wafer unit, and a measuring step of measuring the device chip picked up in the pick-up step. The method also includes a distinguishing step, before the pick-up step, of inspecting properties of the devices to distinguish acceptable devices and defective devices among the devices and storing distinguished results.Type: GrantFiled: March 15, 2023Date of Patent: February 13, 2024Assignee: DISCO CORPORATIONInventors: Takashi Mori, Makoto Kobayashi, Kazunari Tamura, Okito Umehara
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Publication number: 20230223303Abstract: There is provided a method of processing a wafer having devices formed in respective areas on a face side thereof that are demarcated by a plurality of crossing projected dicing lines on the face side. The method of processing a wafer includes a wafer unit forming step of forming a wafer unit having a wafer, a tape, and an annular frame, a dividing step of dividing the wafer along the projected dicing lines into a plurality of device chips, a pick-up step of picking up one at a time of the device chips from the wafer unit, and a measuring step of measuring the device chip picked up in the pick-up step. The method also includes a distinguishing step, before the pick-up step, of inspecting properties of the devices to distinguish acceptable devices and defective devices among the devices and storing distinguished results.Type: ApplicationFiled: March 15, 2023Publication date: July 13, 2023Inventors: Takashi MORI, Makoto KOBAYASHI, Kazunari TAMURA, Okito UMEHARA
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Patent number: 11637039Abstract: There is provided a method of processing a wafer having devices formed in respective areas on a face side thereof that are demarcated by a plurality of crossing projected dicing lines on the face side. The method of processing a wafer includes a wafer unit forming step of forming a wafer unit having a wafer, a tape, and an annular frame, a dividing step of dividing the wafer along the projected dicing lines into a plurality of device chips, a pick-up step of picking up one at a time of the device chips from the wafer unit, and a measuring step of measuring the device chip picked up in the pick-up step. The method also includes a distinguishing step, before the pick-up step, of inspecting properties of the devices to distinguish acceptable devices and defective devices among the devices and storing distinguished results.Type: GrantFiled: September 17, 2020Date of Patent: April 25, 2023Assignee: DISCO CORPORATIONInventors: Takashi Mori, Makoto Kobayashi, Kazunari Tamura, Okito Umehara
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Patent number: 11474143Abstract: A testing apparatus for measuring a strength of a chip includes: a cassette mounting base on which to mount a cassette capable of accommodating wafer units; a frame fixing mechanism that fixes an annular frame of the wafer unit; a conveying mechanism that conveys the wafer unit between the cassette and the frame fixing mechanism; a pushing-up mechanism that pushes up a predetermined chip included in the wafer supported by the annular frame fixed by the frame fixing mechanism; a pick-up mechanism having a collet picking up the chip pushed up by the pushing-up mechanism; a strength measuring mechanism having a support unit supporting the chip picked up by the collet; and a collet moving mechanism that moves the collect from a position facing the pushing-up mechanism to a position facing the support unit.Type: GrantFiled: December 9, 2019Date of Patent: October 18, 2022Assignee: DISCO CORPORATIONInventors: Makoto Kobayashi, Okito Umehara, Yoshinobu Saito, Yusaku Ito, Hirohide Yano, Kazunari Tamura
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Publication number: 20210090954Abstract: There is provided a method of processing a wafer having devices formed in respective areas on a face side thereof that are demarcated by a plurality of crossing projected dicing lines on the face side. The method of processing a wafer includes a wafer unit forming step of forming a wafer unit having a wafer, a tape, and an annular frame, a dividing step of dividing the wafer along the projected dicing lines into a plurality of device chips, a pick-up step of picking up one at a time of the device chips from the wafer unit, and a measuring step of measuring the device chip picked up in the pick-up step. The method also includes a distinguishing step, before the pick-up step, of inspecting properties of the devices to distinguish acceptable devices and defective devices among the devices and storing distinguished results.Type: ApplicationFiled: September 17, 2020Publication date: March 25, 2021Inventors: Takashi MORI, Makoto KOBAYASHI, Kazunari TAMURA, Okito UMEHARA
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Publication number: 20200182923Abstract: A testing apparatus for measuring a strength of a chip includes: a cassette mounting base on which to mount a cassette capable of accommodating wafer units; a frame fixing mechanism that fixes an annular frame of the wafer unit; a conveying mechanism that conveys the wafer unit between the cassette and the frame fixing mechanism; a pushing-up mechanism that pushes up a predetermined chip included in the wafer supported by the annular frame fixed by the frame fixing mechanism; a pick-up mechanism having a collet picking up the chip pushed up by the pushing-up mechanism; a strength measuring mechanism having a support unit supporting the chip picked up by the collet; and a collet moving mechanism that moves the collect from a position facing the pushing-up mechanism to a position facing the support unit.Type: ApplicationFiled: December 9, 2019Publication date: June 11, 2020Inventors: Makoto KOBAYASHI, Okito UMEHARA, Yoshinobu SAITO, Yusaku ITO, Hirohide YANO, Kazunari TAMURA
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Die pickup apparatus for picking up semiconductor dies and methods for picking up semiconductor dies
Patent number: 7820006Abstract: A die pickup apparatus facilitates picking up a semiconductor die in a manner such that, in a state in which a semiconductor die to be picked up is suctioned by a collet, a frontal end of a cover plate is caused to extend from a contact surface, and the cover plate is caused to slide while pushing up a dicing sheet and the semiconductor die, and subsequently a rear end of the cover plate is caused to extend from the contact surface such that an upper surface of the cover plate is substantially in parallel with the contact surface, the cover plate is caused to slide while pushing the dicing sheet and the semiconductor die with the upper surface of the cover plate such that the suction opening is opened, and the dicing sheet is suctioned into the opened suction opening, thereby separating the dicing sheet.Type: GrantFiled: March 1, 2010Date of Patent: October 26, 2010Assignee: Shinkkawa Ltd.Inventors: Okito Umehara, Kuniyuki Takahashi -
Die Pickup Apparatus for Picking Up Semiconductor Dies and Methods for Picking Up Semiconductor Dies
Publication number: 20100226745Abstract: A die pickup apparatus facilitates picking up a semiconductor die in a manner such that, in a state in which a semiconductor die to be picked up is suctioned by a collet, a frontal end of a cover plate is caused to extend from a contact surface, and the cover plate is caused to slide while pushing up a dicing sheet and the semiconductor die, and subsequently a rear end of the cover plate is caused to extend from the contact surface such that an upper surface of the cover plate is substantially in parallel with the contact surface, the cover plate is caused to slide while pushing the dicing sheet and the semiconductor die with the upper surface of the cover plate such that the suction opening is opened, and the dicing sheet is suctioned into the opened suction opening, thereby separating the dicing sheet.Type: ApplicationFiled: March 1, 2010Publication date: September 9, 2010Applicant: SHINKAWA LTD.Inventors: Okito Umehara, Kuniyuki Takahashi -
Publication number: 20090101282Abstract: A die pick-up apparatus and method using a wiper that has a tip end moving in and out of an adherence surface of a die stage and a shutter that is moved with the wiper while blocking a suction window formed in the adherence surface. When picking up a semiconductor die, the tip end of the wiper is aligned with a first end of the die, the wiper is moved along the adherence surface while the tip end of the wiper is protruded from the adherence surface with the die being suction-held by a collet. A suction opening is sequentially opened between a first end surface of the suction window and a seat surface of the wiper as the wiper is moved, and a dicing sheet attached to the die is suctioned into the suction opening that has been opened and sequentially peeled off from the die.Type: ApplicationFiled: September 5, 2008Publication date: April 23, 2009Inventors: Noboru Fujino, Okito Umehara, Akio Katsuro, Shinichi Sasaki
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Publication number: 20090075459Abstract: A die pick-up apparatus and method using a die stage having an adherence surface, a suction window formed in the adherence surface and larger than a semiconductor die to be picked up, and a cover plate that slides along the adherence surface and opens and closes the suction window. When picking up the semiconductor die, the surface of the cover plate is caused to be closely contacted to a dicing sheet that is attached to the die so that the die is within the boundary of the upper surface of the cover plate that closes the suction window, and then the dicing sheet is sequentially peeled off as, while the die is being suctioned by a collet, the cover plate gradually slides to sequentially open the suction window and allow the dicing sheet to be suctioned into the opened suction window.Type: ApplicationFiled: September 5, 2008Publication date: March 19, 2009Inventors: Yasushi Sato, Okito Umehara, Akio Katsuro, Shinichi Sasaki