Patents by Inventor Ok Nam KIM

Ok Nam KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat radiating member and printed circuit board including same
    Patent number: 10028373
    Abstract: A heat radiating member includes a body region having a first main surface and a second main surface opposing each other and lateral surfaces connecting the first main surface and the second main surface and having concave surfaces, and a curved surface region formed to have a convex surface on an edge at which at least one of the first main surface and the second main surface meets one of the lateral surfaces.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: July 17, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Seong Kim, Eun Sang Na, Ok Nam Kim
  • Embedded device, and printed circuit board having the same
    Patent number: 9847172
    Abstract: An embedded device includes a multilayer body including dielectric layers and internal electrode layers interposed between adjacent dielectric layers; external electrodes disposed on external surfaces of the multilayer body to apply electric charges having different polarities to adjacent internal electrode layers, the external electrodes containing a conductive material; first copper layers disposed on external surfaces of the external electrodes to cover the external electrodes; and second copper layers disposed on the first copper layers to cover the first copper layers. An average particle diameter of powder particles of the first copper layers is greater than an average particle diameter of powder particles of the second copper layers.
    Type: Grant
    Filed: October 22, 2015
    Date of Patent: December 19, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Seong Kim, Eun Sang Na, Jin Sung Kim, Ok Nam Kim, Tae Hyeok Kim, Jin Man Jung
  • HEAT RADIATING MEMBER AND PRINTED CIRCUIT BOARD INCLUDING SAME
    Publication number: 20170048964
    Abstract: A heat radiating member includes a body region having a first main surface and a second main surface opposing each other and lateral surfaces connecting the first main surface and the second main surface and having concave surfaces, and a curved surface region formed to have a convex surface on an edge at which at least one of the first main surface and the second main surface meets one of the lateral surfaces.
    Type: Application
    Filed: August 4, 2016
    Publication date: February 16, 2017
    Inventors: Hye Seong KIM, Eun Sang NA, Ok Nam KIM
  • EMBEDDED DEVICE, AND PRINTED CIRCUIT BOARD HAVING THE SAME
    Publication number: 20160174380
    Abstract: An embedded device includes a multilayer body including dielectric layers and internal electrode layers interposed between adjacent dielectric layers; external electrodes disposed on external surfaces of the multilayer body to apply electric charges having different polarities to adjacent internal electrode layers, the external electrodes containing a conductive material; first copper layers disposed on external surfaces of the external electrodes to cover the external electrodes; and second copper layers disposed on the first copper layers to cover the first copper layers. An average particle diameter of powder particles of the first copper layers is greater than an average particle diameter of powder particles of the second copper layers.
    Type: Application
    Filed: October 22, 2015
    Publication date: June 16, 2016
    Inventors: Hye Seong KIM, Eun Sang NA, Jin Sung KIM, Ok Nam KIM, Tae Hyeok KIM, Jin Man JUNG