Abstract: The invention relates to a process for connecting glass substrates which allows glass substrates to be aligned in a site-specific manner and to subsequently be connected to one another, and to the site-specifically aligned and interconnected glass substrates. Generally, the process relates to connecting glass substrates to one another, optionally also without site-specific alignment. The interconnected glass substrates obtainable by processes according to the invention are characterized by a firm bond with one another, which is preferably formed by solidified glass solder that is in form-fitting engagement with the glass substrates. Therein, recesses, which are preformed in the glass substrate, with glass solder are used for aligning and optionally for connecting the glass substrates.

Abstract: The invention provides a process for producing plastic parts, each of which has at least one glass insert which is connected to the plastic part along a connecting region, and the glass insert is free of plastic in the region encompassed by the connecting region and forms a glass window. The connecting region of the glass insert is preferably circumferentially closed. The glass window can have through-holes or preferably recesses extending only over a portion of the thickness of the glass window and having microstructures.

Abstract: The invention relates to a carrier which is suitable for the cultivation of cells and is preferably a plate-shaped carrier, e.g. made of glass, silicon or plastic or a combination thereof, in which carrier at least one first recess is formed which extends over a first thickness portion of the carrier, wherein an array of second recesses extends from the first recess into a second thickness portion of the carrier adjacent to the first thickness portion. The first thickness portion may have a thickness of a few micrometres to several centimetres. The second recesses, which extend from a first recess into the second thickness portion and each form a second array, form cups which are suitable for receiving cells and/or synthetic particles, e.g. made of plastic or glass.

Abstract: A process for the production of a glass-plastic connection which is form-fitting, and to a form-fitting composite between glass and plastic which is obtainable by the process. The process and the glass-plastic composite are characterized in that a glass, which in particular is planar, neither during the process nor in the glass-plastic composite is subjected to a mechanical load which could lead to cracks, e.g. microcracks. Accordingly, in the composite, the glass is connected to a plastic in a stress-free manner The composite of glass with plastic is especially gas-proof and/or liquid-proof.

Abstract: The invention relates to a process for connecting glass substrates which allows glass substrates to be aligned in a site-specific manner and to subsequently be connected to one another, and to the site-specifically aligned and interconnected glass substrates. Generally, the process relates to connecting glass substrates to one another, optionally also without site-specific alignment. The interconnected glass substrates obtainable by processes according to the invention are characterized by a firm bond with one another, which is preferably formed by solidified glass solder that is in form-fitting engagement with the glass substrates. Therein, recesses, which are preformed in the glass substrate, with glass solder are used for aligning and optionally for connecting the glass substrates.