Patents by Inventor Ola Ragnar Tageman

Ola Ragnar Tageman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wireless communications package with integrated antenna array
    Patent number: 11658390
    Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: May 23, 2023
    Assignees: International Business Machines Corporation, Ericsson AB
    Inventors: Christian W. Baks, Daniel J. Friedman, Xiaoxiong Gu, Duixian Liu, Alberto Valdes Garcia, Joakim Hallin, Ola Ragnar Tageman
  • WIRELESS COMMUNICATIONS PACKAGE WITH INTEGRATED ANTENNA ARRAY
    Publication number: 20200161744
    Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.
    Type: Application
    Filed: January 23, 2020
    Publication date: May 21, 2020
    Inventors: Christian W. Baks, Daniel J. Friedman, Xiaoxiong Gu, Duixian Liu, Alberto Valdes Garcia, Joakim Hallin, Ola Ragnar Tageman
  • Wireless communications package with integrated antenna array
    Patent number: 10594019
    Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.
    Type: Grant
    Filed: December 3, 2016
    Date of Patent: March 17, 2020
    Assignees: International Business Machines Corporation, Ericsson AB
    Inventors: Christian W. Baks, Daniel J. Friedman, Xiaoxiong Gu, Duixian Liu, Alberto Valdes Garcia, Joakim Hallin, Ola Ragnar Tageman
  • WIRELESS COMMUNICATIONS PACKAGE WITH INTEGRATED ANTENNA ARRAY
    Publication number: 20180159203
    Abstract: Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes multilayer package substrate, a planar antenna array, antenna feed lines, and resistive transmission lines. The planar antenna array includes an array of active antenna elements and dummy antenna elements surrounding the array of active antenna elements. Each active antenna element is coupled to a corresponding one of the antenna feed lines, and each dummy antenna element is coupled to a corresponding one of the resistive transmission lines. Each resistive transmission line extends through the multilayer package substrate and is terminated in a same metallization layer of the multilayer package substrate.
    Type: Application
    Filed: December 3, 2016
    Publication date: June 7, 2018
    Inventors: Christian W. Baks, Daniel J. Friedman, Xiaoxiong Gu, Duixian Liu, Alberto Valdes Garcia, Joakim Hallin, Ola Ragnar Tageman