Patents by Inventor Olaf Kurtz

Olaf Kurtz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220389603
    Abstract: The present invention relates to an aqueous passivation solution having a pH in the range from 5.4 to 7.2, the solution including trivalent chromium ions, and formate anions and/or oxalate anions as complexing agents for said trivalent chromium ions, in which the trivalent chromium ions with respect to all formate anions together with all oxalate anions form a molar ratio in the range from 1:15 to 1:400.
    Type: Application
    Filed: August 15, 2022
    Publication date: December 8, 2022
    Inventors: Robert RÜTHER, Olaf KURTZ, Joko SETYADI-LIE, Tse-Cheen FOONG
  • Patent number: 11447884
    Abstract: A method for electrolytically passivating a surface of silver, silver alloy, gold, or gold alloy, the method comprising the steps of (i) providing a substrate comprising the surface, (ii) providing an aqueous passivation solution comprising trivalent chromium ions, and one or more than one species of carboxylic acid residue anions, (iii) contacting the substrate with the passivation solution and passing an electrical current between the substrate as a cathode and an anode such that a passivation layer is electrolytically deposited onto the surface, wherein the trivalent chromium ions with respect to all species of carboxylic acid residue anions form a molar ratio in the range from 1:10 to 1:400.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: September 20, 2022
    Assignee: Atotech Deutschland GmbH & Co. KG
    Inventors: Robert Rüther, Olaf Kurtz, Joko Setyadi-Lie, Tse-Cheen Foong
  • Publication number: 20210348291
    Abstract: The present invention relates to a method for electrolytically passivating a surface of silver, silver alloy, gold, or gold alloy, the method comprising the steps of (i) providing a substrate comprising said surface, (ii) providing an aqueous passivation solution comprising trivalent chromium ions, and one or more than one species of carboxylic acid residue anions, (iii) contacting the substrate with said passivation solution and passing an electrical current between the substrate as a cathode and an anode such that a passivation layer is electrolytically deposited onto said surface, wherein the trivalent chromium ions with respect to all species of carboxylic acid residue anions form a molar ratio in the range from 1:10 to 1:400.
    Type: Application
    Filed: October 18, 2019
    Publication date: November 11, 2021
    Inventors: Robert RÜTHER, Olaf KURTZ, Joko SETYADI-LIE, Tse-Cheen FOONG
  • Publication number: 20190271093
    Abstract: To achieve tin deposits being largely free of pressure induced whiskers, a method of depositing a tin layer on a metal substrate is devised, wherein said method comprises: (a) providing said metal substrate; (b) depositing a nickel/phosphorous alloy underlayer on at least one surface of said metal substrate; and (c) depositing said tin layer on said nickel/phosphorous alloy underlayer by depositing said tin layer comprising using a pulse plating method.
    Type: Application
    Filed: October 24, 2017
    Publication date: September 5, 2019
    Applicant: Atotech Deutschland GmbH
    Inventors: Din-Ghee NEOH, Chee-Chow TAN, Jen Joo LIM, Robert RÜTHER, Jürgen BARTHELMES, Olaf KURTZ
  • Publication number: 20190177859
    Abstract: A water-based composition for post-treatment of metal surfaces, preferably a silver or silver alloy surface, including: an alkanethiol an anionic, cationic, non-ionic, amphoteric or zwitterionic surfactant with a HLB value of 12 to 18, a compound of the general formula I: wherein R1 is —H, —CH3, —C2H5, —(C2H4O)p—H, —(C2H4O)p—CH3, —(C2H4O)p—CH(CH3)2, —(C2H4)p—C(CH3)3, wherein p is 1 to 20, R2 is H, or CH3 n is an integer in the range of 0 to 3, m is an integer in the range of 0 to 2.
    Type: Application
    Filed: June 23, 2017
    Publication date: June 13, 2019
    Applicant: Atotech Deutschland GmbH
    Inventors: Chiho ARAI, Florence LAGORCE-BROC, Robert RÜTHER, Olaf KURTZ
  • Publication number: 20170159195
    Abstract: The present invention relates to a composition and method for electrodepositing gold containing layers using the composition and the use of mercapto-triazole compounds as anti-immersion additives. The composition contains a mercapto-triazole compound which acts as an anti-immersion additive. The composition and method are suited for depositing functional or hard gold or gold alloys that can be applied in the industry as contact material of electrical connectors for high reliability applications.
    Type: Application
    Filed: August 21, 2015
    Publication date: June 8, 2017
    Inventors: Jana BREITFELDER, Robert RUETHER, Olaf KURTZ
  • Patent number: 9057145
    Abstract: A method for electrodepositing a metal layer from an electrolytic bath is described, wherein the concentrations of at least two components of the electrolytic bath are monitored by carrying out the following steps: (a) a sample is taken from the electrolytic bath; (b) the sample is supplied to a column for solid phase extraction, which contains a solid sorbent material; (c) the column is subjected to a washing procedure with a first eluent, wherein the at least two components remain on the column, and undesired components are eluted from the column; (d) the at least two components are eluted from the column by a second eluent; (e) the concentrations of the at least two components in the eluate obtained in step (d) are determined without separating the components from each other. In this method the use of poly(divinyl benzene-co-N-vinyl pyrrolidone) for solid phase extraction is particularly advantageous.
    Type: Grant
    Filed: December 10, 2007
    Date of Patent: June 16, 2015
    Assignee: Atotech Deutschland GmbH
    Inventors: Jürgen Barthelmes, Robert Rüther, Florence Lagorce-Broc, Olaf Kurtz, Oleg Sprenger, Marta Sainz-Vila, Thomas Moritz, Josef Gaida
  • Patent number: 8491713
    Abstract: Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: July 23, 2013
    Assignee: Atotech Deutschland GmbH
    Inventors: Jürgen Barthelmes, Robert Ruether, Olaf Kurtz, Jana Breitfelder
  • Patent number: 8304658
    Abstract: The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness ?3.0 ?m, (ii) a Ni—P layer having a thickness ?1.0 ?m, and (iii) a Au layer having a thickness ?1.0 ?m.
    Type: Grant
    Filed: March 5, 2009
    Date of Patent: November 6, 2012
    Assignee: Atotech Deutschland GmbH
    Inventors: Juergen Barthelmes, Robert Ruether, Olaf Kurtz, Michael Danker
  • Publication number: 20110281124
    Abstract: Described is a new a solution comprising a phosphorous compound and optionally a solderability-enhancing compound and its use in a process for increasing the solderability and corrosion resistance of a metal or metal alloy surface.
    Type: Application
    Filed: January 13, 2010
    Publication date: November 17, 2011
    Inventors: Jürgen Barthelmes, Robert Ruether, Olaf Kurtz, Jana Breitfelder
  • Patent number: 8042726
    Abstract: To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate.
    Type: Grant
    Filed: August 2, 2007
    Date of Patent: October 25, 2011
    Assignee: Atotech Deutschland GmbH
    Inventors: Ralph Herber, Olaf Kurtz, Johannes Etzkorn, Christian Madry, Carsten Schwiekendick, Gerd Schafer
  • Publication number: 20110189481
    Abstract: The present invention relates to aqueous post-treatment compositions and an immersion and/or electrolytical process using said compositions for corrosion protection of metal and/or metal alloy surfaces. The aqueous post-treatment compositions comprise at least one polysiloxane betaine compound and at least one phosphorus containing compound.
    Type: Application
    Filed: October 21, 2009
    Publication date: August 4, 2011
    Inventors: Jürgen Barthelmes, Michael Danker, Olaf Kurtz, Florence Lagorce-Broc, Robert Rüther
  • Patent number: 7987899
    Abstract: For providing a particularly efficient micro-structured cooler intended more specifically for cooling electronic components, it is proposed to proceed in the following manner to build this cooler: providing a stack of at least two metal foils (1) comprising channels (2) for coolant and one base plate (5) adapted to be brought into thermal contact with the electronic component (4) through a thermal contact surface (6), said metal foils (1) and said base plate (5) being joined together so as to form a single piece of material, said channels (2) having a width b ranging from 100 to 350 ?m, a depth t ranging from 30 to 150 ?m, a mean spacing s ranging from 30 to 300 ?m, residual foil thickness r remaining after formation of the channels (2) in the metal foils (1) ranging from 30 to 300 ?m and said base plate (5) having a thickness g ranging from 100 to 1,000 ?m.
    Type: Grant
    Filed: July 12, 2006
    Date of Patent: August 2, 2011
    Assignee: Atotech Deutschland GmbH
    Inventors: Olaf Kurtz, Ralph Herber, Peter Prechtl, Sven Theisen, Markus Höhn
  • Patent number: 7909987
    Abstract: For manufacturing micro-structured reactors with passageways loaded with catalyst using the pre-coat method, a method is provided which comprises the following method steps: a) producing reactor layers having bonding areas as well as passageway areas in which the passageways are formed, b) applying at least one bonding layer onto the reactor layers in the bonding areas, c) loading the reactor layers in the passageway areas with the catalyst and d) bonding the reactor layers, the bonding layer being applied and masked before the reactor layers are loaded with the catalyst. As a result, it is ensured that the efficiency of the catalyst will not be affected during manufacturing. The reactor may be used as a methane and methanol reformer in particular.
    Type: Grant
    Filed: February 22, 2007
    Date of Patent: March 22, 2011
    Assignee: Atotech Deutschland GmbH
    Inventors: Olaf Kurtz, Ralph Herber, Christian Madry, Gerd Schäfer
  • Publication number: 20100326713
    Abstract: The invention relates to a layer system comprising on a substrate, the surface of which has been electropolished, (i) a Ni layer having a thickness ?3.0 ?m, (ii) a Ni—P layer having a thickness ?1.0 ?m, (iii) a Au layer having a thickness ?1.0 ?m.
    Type: Application
    Filed: March 5, 2009
    Publication date: December 30, 2010
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Juergen Barthelmes, Robert Ruether, Olaf Kurtz, Michael Danker
  • Publication number: 20100059384
    Abstract: A method for electrodepositing a metal layer from an electrolytic bath is described, wherein the concentrations of at least two components of the electrolytic bath are monitored by carrying out the following steps: (a) a sample is taken from the electrolytic bath; (b) the sample is supplied to a column for solid phase extraction, which contains a solid sorbent material; (c) the column is subjected to a washing procedure with a first eluent, wherein the at least two components remain on the column, and undesired components are eluted from the column; (d) the at least two components are eluted from the column by a second eluent; (e) the concentrations of the at least two components in the eluate obtained in step (d) are determined without separating the components from each other. In this method the use of poly(divinyl benzene-co-N-vinyl pyrrolidone) for solid phase extraction is particularly advantageous.
    Type: Application
    Filed: December 10, 2007
    Publication date: March 11, 2010
    Applicant: Atotech Deutschland GmbH
    Inventors: Jürgen Barthelmes, Robert Rüther, Florence Lagorce-Broc, Olaf Kurtz, Oleg Sprenger, Marta Sainz-Vila, Thomas Moritz, Josef Gaida
  • Publication number: 20090250379
    Abstract: For manufacturing micro-structured reactors with passageways loaded with catalyst using the pre-coat method, a method is provided which comprises the following method steps: a) producing reactor layers having bonding areas as well as passageway areas in which the passageways are formed, b) applying at least one bonding layer onto the reactor layers in the bonding areas, c) loading the reactor layers in the passageway areas with the catalyst and d) bonding the reactor layers, the bonding layer being applied and masked before the reactor layers are loaded with the catalyst. As a result, it is ensured that the efficiency of the catalyst will not be affected during manufacturing. The reactor may be used as a methane and methanol reformer in particular.
    Type: Application
    Filed: February 22, 2007
    Publication date: October 8, 2009
    Applicant: ATOTECH DEUTSCHLAND GMBH
    Inventors: Olaf Kurtz, Ralph Herber, Christian Madry, Gerd Schäfer
  • Publication number: 20090202858
    Abstract: To form high performance bonding connections suitable for producing micro-structured components made of a plurality of individual layers, bonding by the steps; providing at least two work pieces; forming a metal bonding layer on at least one side of at least one of said at least two work pieces by chemical or electrolytic metal plating method; the metal bonding layer being a nickel/phosphorous alloy having a prescribed phosphorous content and prescribed thickness; forming a bonding arrangement comprising said work pieces so that there is at least one metal bonding layer between said at least two respective work pieces; heating at a prescribed heating rate to a temperature above the melting temperature of the bonding layer; bonding the two work pieces by applying contact pressure within a prescribed range; and cooling at a prescribed rate.
    Type: Application
    Filed: August 2, 2007
    Publication date: August 13, 2009
    Applicant: ATOTECH DEUTSCHLAND GmbH
    Inventors: Ralph Herber, Olaf Kurtz, Johannes Etzkorn, Christian Madry, Carsten Schwiekendick, Gerd Schäfer
  • Publication number: 20080217381
    Abstract: For forming very strong bond joints suited for manufacturing micro-structured components consisting of plurality of individual layers, a bonding method is proposed by which a bonding arrangement of the work pieces is formed that comprises at least one metallic bonding layer interposed therein between and by which the bonding arrangement is heated to a bonding temperature below the melting temperature of the at least one bonding layer. In accordance with the invention, the at least one bonding layer is deposited using a chemical or electrolytic method.
    Type: Application
    Filed: June 28, 2006
    Publication date: September 11, 2008
    Applicant: Atotech Deutschland GmbH
    Inventors: Heinrich Meyer, Olaf Kurtz, Ralph Herber, Chirstian Madry, Johannes Etzkorn, Thomas Vago
  • Publication number: 20080196875
    Abstract: For providing a particularly efficient micro-structured cooler intended more specifically for cooling electronic components, it is proposed to proceed in the following manner to build this cooler: providing a stack of at least two metal foils (1) comprising channels (2) for coolant and one base plate (5) adapted to be brought into thermal contact with the electronic component (4) through a thermal contact surface (6), said metal foils (1) and said base plate (5) being joined together so as to form a single piece of material, said channels (2) having a width b ranging from 100 to 350 ?m, a depth t ranging from 30 to 150 ?m, a mean spacing s ranging from 30 to 300 ?m, residual foil thickness r remaining after formation of the channels (2) in the metal foils (1) ranging from 30 to 300 ?m and said base plate (5) having a thickness g ranging from 100 to 1,000 ?m, said cooler further having at least one splitting chamber (10) traversing the metal foils (1) approximately in the region of the thermal contact surface
    Type: Application
    Filed: July 12, 2006
    Publication date: August 21, 2008
    Applicant: Atotech Deutschland GmbH
    Inventors: Olaf Kurtz, Ralph Herber, Peter Prechtl, Sven Theisen, Markus Hohn