Patents by Inventor Olaf Lucke

Olaf Lucke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7236367
    Abstract: The invention relates to a power electronics component that comprises a planar ceramics substrate (2) on whose one face condutor tracks (6), applied in thick-film technique, are disposed for electrically connecting electrical power components (7) of a circuit that are also disposed on the ceramics substrate (2). The ceramics substrate (2), with its other face, is brazed onto a metal a metal support element (1) that serves as a heat spreader. The support element (1) is linked with a thermoconducting housing part housing that accommodates the support element (1) in a thermoconductive manner. On the face of the support element (1) facing away from the ceramics substrate (2), approximately opposite the ceramics substrate (2), a second ceramics substrate (4) is brazed onto the ceramics substrate (2) that carries the circuit and has approximately the same dimensions.
    Type: Grant
    Filed: August 29, 2002
    Date of Patent: June 26, 2007
    Assignee: Siemens Aktiengesellschaft
    Inventors: Olaf Lucke, Bernd Thyzel
  • Patent number: 6846987
    Abstract: The invention relates to a power electronics component that comprises a support element on which conductor tracks (5) are disposed for electrically connecting the electrical power components (7) that are also disposed on the support element and the control components of a circuit. The support element is linked with a thermoconducting housing part of a housing that accommodates the support element in a thermoconductive manner. The support element consists of a porous, ceramics component whose pores are filled with metal and which is covered by a thick-film dielectric on which the conductor tracks (5), in the form of thick-film conductor tracks, and the power components (7) are disposed, and the conductor tracks (5) arm connected to the electrical power components (7) in a electroconductive manner. The support element is disposed to rest against the housing component.
    Type: Grant
    Filed: August 29, 2002
    Date of Patent: January 25, 2005
    Assignee: Siemens Aktiengesellschaft
    Inventors: Olaf Lucke, Bernd Thyzel
  • Publication number: 20040264140
    Abstract: The invention relates to a power electronics component that comprises a planar ceramics substrate (2) on whose one face condutor tracks (6), applied in thick-film technique, are disposed for electrically connecting electrical power components (7) of a circuit that are also disposed on the ceramics substrate (2). The ceramics substrate (2), with its other face, is brazed onto a metal support element (1) that serves as a heat spreader. The support element (1) is linked with a thermoconducting housing part (9) of a housing that accommodates the support element (1) in a thermoconductive manner. On the face of the support element (1) facing away from the ceramics substrate (2), approximately opposite the ceramics substrate (2), a second ceramics substrate (4) is brazed onto the ceramics substrate (2) that carries the circuit and has approximately the same dimensions.
    Type: Application
    Filed: February 26, 2004
    Publication date: December 30, 2004
    Inventors: Olaf Lucke, Bernd Thyzel
  • Publication number: 20040206534
    Abstract: The invention relates to a power electronics component that comprises a support element on which conductor tracks (5) are disposed for electrically connecting the electrical power components (7) that are also disposed on the support element and the control components of a circuit. The support element is linked with a thermoconducting housing part of a housing that accommodates the support element in a thermoconductive manner. The support element consists of a porous, ceramics component whose pores are filled with metal and which is covered by a thick-film dielectric on which the conductor tracks (5), in the form of thick-film conductor tracks, and the power components (7) are disposed, and the conductor tracks (5) are connected to the electrical power components (7) in a electroconductive manner. The support element is disposed to rest against the housing component.
    Type: Application
    Filed: February 25, 2004
    Publication date: October 21, 2004
    Inventors: Olaf Lucke, Bernd Thyzel