Patents by Inventor Olaf Pfenningstorf

Olaf Pfenningstorf has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Passivation for wafer level—chip-scale package devices
    Patent number: 8853859
    Abstract: Aspects of the disclosure are directed towards an efficient wafer level chip-scale package, and methods or producing the packages. Various aspects are directed to protecting against humidity, contamination, mechanical damage, and current leakage while maintaining isolation and manufacturability of the plastic package and a ratio of active die size to package size.
    Type: Grant
    Filed: May 4, 2012
    Date of Patent: October 7, 2014
    Assignee: NXP B.V.
    Inventors: Olaf Pfenningstorf, Wolfgang Schnitt