Patents by Inventor Olaf Schmeckebier

Olaf Schmeckebier has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor structure integrated under a pad
    Patent number: 7190077
    Abstract: An integrated semiconductor structure has a substrate, a semiconductor element located on the substrate, a pad metal, metal layers located between the pad metal and the substrate, and insulation layers that separate the metal layers from one another. The pad metal extends over at least—part of the semiconductor element. Below the surface of the pad metal, at least the top two metal layers include two or more adjacent interconnects.
    Type: Grant
    Filed: June 12, 2003
    Date of Patent: March 13, 2007
    Assignee: Infineon Technologies AG
    Inventors: Robert Bauer, Werner Ertle, Till Frohnmüller, Bernd Goller, Reinhard Greiderer, Oliver Nagler, Olaf Schmeckebier, Wolfgang Stadler
  • Semiconductor structure integrated under a pad
    Publication number: 20050242374
    Abstract: An integrated semiconductor structure has a substrate, a semiconductor element located on the substrate, a pad metal, metal layers located between the pad metal and the substrate, and insulation layers that separate the metal layers from one another. The pad metal extends over at least -part of the semiconductor element. Below the surface of the pad metal, at least the top two metal layers include two or more adjacent interconnects.
    Type: Application
    Filed: June 12, 2003
    Publication date: November 3, 2005
    Inventors: Robert Bauer, Werner Ertle, Till Frohnmuller, Bernd Goller, Reinhard Greiderer, Oliver Nagler, Olaf Schmeckebier, Wolfgang Stadler