Abstract: An apparatus is described having: a baseplate; an AC busbar mounted on the baseplate; a DC busbar having an upper DC busbar, a lower DC busbar and an insulating material therebetween, wherein the DC busbar is mounted such that the lower DC busbar is mounted to the baseplate and wherein the upper DC busbar has one or more openings through which the lower DC busbar is exposed; a first group of switching components mounted on the AC busbar, wherein the first group of switching components are connected to the upper DC busbar using first electrical connection means; and a second group of switching components mounted on the lower DC busbar, wherein at least one of the switching components of said second group of switching components is mounted within one of said openings, wherein the second group of switching components are to the AC busbar using second electrical connection means.

Abstract: A power module (2) including a rigid insulated substrate (10) mounted on a baseplate (4) is disclosed. An additional circuit carrier (6, 8) is mounted on the baseplate (4) adjacent to the rigid insulated substrate (10). The additional circuit carrier (6, 8) has a rigidity which is less than that of the rigid insulated substrate (10).

Abstract: A power module (2) including a molded package (4), three power terminals (6, 8, 10) protruding from a first side (40) of the molded package (4) is disclosed. The power terminals (6, 8, 10) include a positive DC terminal (6), a neutral terminal (8) and a negative terminal (10). The power module (2) includes a phase output power terminal (12) protruding from a second side (42) of the molded package (4). The power module (2) is a three-level power module including a plurality of control pins (14, 16, 18, 20, 22, 24, 26, 28, 30, 32, 34, 36) protruding from the second side (42) of the molded package (4).

Abstract: The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).

Abstract: The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).

Abstract: The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).

Abstract: The invention relates to an electronic power system (1) comprising at least one electronic power module (2). The electronic power module (2) comprises a base plate (3) and at least one heat generating component arranged on a first side of the base plate (3). The electronic power module (2) comprises a cooling structure (4) transporting heat away from the electronic power module (2) via a coolant that is guided by the cooling structure (4). The cooling structure (4) is arranged on a second side (5) of the base plate (3) opposite to the first side. Task of the invention is to provide an electronic power system (1) with an improved cooling. According to the present invention this task is solved in that the cooling structure (4) is integrally formed with the base plate (3).