Patents by Inventor Oleg Schneider

Oleg Schneider has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9958909
    Abstract: A housing design and method of providing electromagnetic compatibility (EMC) by mitigating a slot antenna in a corner region of a housing, the corner profile including an electrically conductive insert that has a spring bias, such as a spring or coated plastic member, in a corner of the housing.
    Type: Grant
    Filed: May 17, 2017
    Date of Patent: May 1, 2018
    Assignee: General Electric Company
    Inventors: Bernd Sporer, Klaus Weinmann, Oleg Schneider
  • Patent number: 9807905
    Abstract: Disclosed herein are apparatuses and methods for the cooling of electronic components of a COM-Express module using an adapter module to become VITA-59 compliant module. The adapter module operatively and thermally couple to a modular computing device, e.g., the COM-Express compliant module, configured with a conduction-cooled plate to provide an additional path for conducting thermal energy generated from integrated circuit components located on the modular computing device. The adapter module includes dimensions and thicknesses to form a spatial gap between an assembled system having the adapter module, the cooling plate, and the modular computing device and a cooling surface of an external heat sink to which the assembled system couples. The spatial gap relative to the cooling plate provides clearance for the adapter module to elastically deform such that the surfaces of the assembly contacts the heat sink when the assembled system is coupled thereto.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: October 31, 2017
    Assignee: General Electric Company
    Inventors: Bernd Sporer, Klaus Weinmann, Oleg Schneider
  • Publication number: 20170150643
    Abstract: Disclosed herein are apparatuses and methods for the cooling of electronic components of a COM-Express module using an adapter module to become VITA-59 compliant module. The adapter module operatively and thermally couple to a modular computing device, e.g., the COM-Express compliant module, configured with a conduction-cooled plate to provide an additional path for conducting thermal energy generated from integrated circuit components located on the modular computing device. The adapter module includes dimensions and thicknesses to form a spatial gap between an assembled system having the adapter module, the cooling plate, and the modular computing device and a cooling surface of an external heat sink to which the assembled system couples. The spatial gap relative to the cooling plate provides clearance for the adapter module to elastically deform such that the surfaces of the assembly contacts the heat sink when the assembled system is coupled thereto.
    Type: Application
    Filed: November 25, 2015
    Publication date: May 25, 2017
    Inventors: Bernd Sporer, Klaus Weinmann, Oleg Schneider
  • Publication number: 20080261792
    Abstract: The present invention relates to a device for manufacturing tubes from a flat film material, including first and second essentially concave rollers, a forming tube situated between the first and second rollers, and a longitudinal sealing device for sealing a longitudinal seam of the tube; the essentially concave rollers each include a multitude of individual disks mounted for free rotation relative to one another about a common axis.
    Type: Application
    Filed: December 5, 2005
    Publication date: October 23, 2008
    Inventors: Bernd Wilke, Helmut Weber, Michael Gensheimer, Carsten Gruber, Markus Trugenberger, Oleg Schneider