Abstract: A Printed Circuit Board (PCB) or substrate has a bump pad layer and a separate trace metal layer. The bump pad layer substantially covers or overlays the trace metal layer. A first surface of a bump pad in the bump pad layer is electrically coupled to a trace in the trace metal layer. A second surface of the bump pad in the bump pad layer extends above a surface of the bump pad layer. When a component is mounted on the substrate during a component mounting process, a pillar or other electrical connection mechanism of the component is electrically coupled to the bump pad without the risk of solder non-wetting and/or the formation of solder bridges between traces and bump pads on the substrate.

Abstract: A semiconductor device includes a first semiconductor die having a top planar surface and a second semiconductor die having a bottom planar surface and a top planar surface. A protective layer including a bottom planar surface and a top planar surface is positioned between the first semiconductor die and the second semiconductor die. An adhesive layer having a top planar surface and a bottom planar surface is between the protective layer and the second semiconductor die. A periphery of the top planar surface of the first semiconductor die is covered by a periphery of the bottom planar surface of the protective layer after cutting a portion of the protective layer that extended past the periphery of the surface of the first semiconductor die. The protective layer reduces the occurrence of peeling of the second semiconductor die and first semiconductor die coupled to the protective layer.